5SGXMA4K1F35C1WN

The 5SGXMA4K1F35C1WN is a commercial-grade Stratix® V GX field programmable gate array (FPGA) IC by Intel. It provides a high-density programmable logic fabric with substantial embedded memory and a large I/O count in a 1152-FBGA (35 × 35) package.

This device is targeted at designs that require extensive on-chip logic capacity, significant embedded RAM, and a high number of external I/Os, while operating within a commercial temperature range and a narrow core voltage supply window.

Key Features

• High Logic Capacity — 420,000 logic elements to implement complex digital systems and large-scale programmable logic designs.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support large buffering, scratchpad storage, and state retention for high-density designs.
• I/O Density — 600 user I/Os for extensive external device interfacing and high-pin-count peripheral connectivity.
• Package — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35 × 35) delivering a dense, board-friendly footprint for space-constrained systems.
• Power Supply — Core voltage supply range from 870 mV to 930 mV to match system power delivery planning and decoupling design.
• Commercial Grade & Temperature Range — Commercial device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex state machines, datapaths, and protocol engines using the device's large logic element count and embedded RAM.
• High I/O systems — Interface to many peripherals, sensors, or parallel buses with the device's 600 user I/Os.
• Compact board designs — Use the 1152-FBGA (35 × 35) package to integrate substantial programmable capability in space-constrained PCBs.

Unique Advantages

• Substantial programmable capacity: 420,000 logic elements enable implementation of large, integrated digital subsystems on a single device.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces external memory dependence and shortens data paths for improved system integration.
• High external connectivity: 600 I/Os support broad peripheral and system-level interfacing without needing additional I/O expanders.
• Commercial temperature fit: Rated for 0 °C to 85 °C operation for mainstream commercial deployments.
• Industry-standard, dense package: 1152-FBGA (35 × 35) package enables high pin-count designs in a compact form factor.
• Regulatory alignment: RoHS compliance supports environmentally conscious product design and procurement.

Why Choose 5SGXMA4K1F35C1WN?

The 5SGXMA4K1F35C1WN delivers a balanced combination of high logic density, ample embedded memory, and extensive I/O in a compact FBGA package, making it well suited for commercial-grade designs that require on-chip integration of complex digital functions. Its specified core voltage range and commercial operating temperature make it appropriate for standard commercial electronics projects requiring precise power delivery and thermal planning.

Design teams seeking a high-capacity Stratix V GX FPGA for dense logic implementation, substantial buffering, and broad external interfacing will find this device aligns with those integration goals while maintaining RoHS compliance.

If you would like pricing or availability information, please request a quote or submit an inquiry to receive a formal sales quotation and technical support for integrating the 5SGXMA4K1F35C1WN into your design.