5SGXMA4H3F35I4WN

The 5SGXMA4H3F35I4WN is a Stratix V GX FPGA offered in an industrial temperature grade and supplied in a 1152-BBGA (35 × 35 mm) FCBGA package. This high-density FPGA integrates approximately 420,000 logic elements, roughly 37.9 Mbits of embedded RAM, and up to 600 user I/O pins to address complex digital logic and system integration requirements.

With a specified core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, the device is suited for designs that require dense logic, substantial on-chip memory, and robust operation across a wide temperature span.

Key Features

• Core Logic — Approximately 420,000 logic elements provide high implementation capacity for complex FPGA designs.
• Embedded Memory — Total on-chip RAM of 37,888,000 bits (approximately 37.9 Mbits) supports data buffering, state storage, and memory-intensive processing inside the FPGA.
• I/O Density — Up to 600 user I/O pins enable wide parallel interfaces and high pin-count system integration.
• Power Supply — Core voltage supply specified from 820 mV to 880 mV to match low-voltage FPGA core rails.
• Package & Mounting — 1152-BBGA FCBGA (supplier package listed as 1152-FBGA, 35×35 mm) in a surface-mount form factor for high-pin-count board designs.
• Temperature & Grade — Industrial grade device with operating temperature range from −40 °C to 100 °C for demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital logic — Implement large-scale custom logic functions and complex finite-state machines where large logic capacity is required.
• I/O‑intensive system integration — Consolidate multiple peripheral interfaces and bus bridges using the device’s high I/O count.
• Memory‑centric processing — Leverage approximately 37.9 Mbits of on-chip RAM for buffering, packet handling, or intermediate data storage without relying solely on external memory.
• Industrial embedded systems — Deploy in temperature-challenging environments that require industrial-grade operation and robust packaging.

Unique Advantages

• High integration density: Combine large logic capacity and substantial embedded RAM on a single device to reduce board-level component count.
• Extensive I/O capability: 600 I/O pins simplify integration with multi-channel interfaces and parallel subsystems.
• Industrial-temperature reliability: Specified operation from −40 °C to 100 °C supports deployment in harsher environments.
• Compact high-pin-count package: 1152-ball BGA (35×35 mm) enables dense PCB routing and system-level consolidation.
• Low-voltage core operation: Narrow core supply range (820–880 mV) facilitates predictable power-rail design for the FPGA core.
• Regulatory compliance: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose 5SGXMA4H3F35I4WN?

The 5SGXMA4H3F35I4WN delivers substantial logic and memory resources in an industrial-grade Stratix V GX FPGA package, making it well suited for engineers who need high-density programmable logic with significant on-chip RAM and a large I/O footprint. Its specification profile—approximately 420,000 logic elements, ~37.9 Mbits of embedded RAM, 600 I/O, a 1152-BBGA package, and an operating range of −40 °C to 100 °C—positions it for demanding embedded and system-integration projects that require consolidation of functions onto a single FPGA.

This device is appropriate for designs that prioritize integration, predictable low-voltage core supply requirements, and operation across a wide temperature range while maintaining compliance with RoHS directives.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the 5SGXMA4H3F35I4WN.