5SGXMA4K1F35C2LN

The 5SGXMA4K1F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC. It delivers high logic density and significant on-chip memory capacity in a 1152-ball BGA package for surface-mount assembly.

This device is part of the Stratix V GX family and targets designs that require large programmable logic resources, substantial embedded memory, and a large number of I/O pins within a commercial temperature grade and RoHS-compliant package.

Key Features

• Core logic — 420,000 logic elements (LEs) to implement complex digital functions and large-scale logic designs.
• Embedded memory — Approximately 38 Mbits of on-chip RAM (Total Ram Bits: 37,888,000) for buffering, FIFOs, and on-chip storage.
• I/O capacity — 600 I/O pins, enabling extensive interfacing to peripherals, memory devices, and system buses.
• Package — 1152-ball FBGA (35 × 35 mm footprint) / 1152-BBGA, FCBGA package case suitable for surface-mount assembly.
• Power — Core supply range specified at 820 mV to 880 mV for the device core domain.
• Temperature and grade — Commercial grade device rated for 0 °C to 85 °C ambient operating temperature.
• Mounting — Surface mount device for standard PCB assembly processes.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic element count and embedded memory to implement complex custom logic and control functions.
• Data interfacing and aggregation — Leverage 600 I/O pins for broad peripheral connectivity and multi-channel interfaces.
• Board-level integration — The 1152-ball FBGA package and surface-mount mounting simplify integration into compact, high-density PCBs.

Unique Advantages

• Large programmable fabric: 420,000 logic elements provide headroom for advanced logic partitioning and system consolidation.
• Substantial on-chip RAM: Approximately 38 Mbits of embedded memory reduces dependency on off-chip memory for buffering and data processing.
• Extensive I/O: 600 I/O pins support complex interfacing requirements and multi-channel connectivity without external expander logic.
• Compact BGA package: 1152-ball FBGA (35 × 35) balances high pin count with a compact footprint for dense system designs.
• Commercial temperature and RoHS compliance: Suited for mainstream electronics applications with standard environmental compliance.

Why Choose 5SGXMA4K1F35C2LN?

The 5SGXMA4K1F35C2LN positions itself as a high-density Stratix V GX FPGA option, combining 420,000 logic elements, approximately 38 Mbits of embedded RAM, and 600 I/O in a 1152-ball FBGA package. Its specified core voltage range and commercial operating temperature make it appropriate for mainstream electronic systems that require substantial on-chip resources and a large number of external interfaces.

This device is suitable for engineers and designers who need to consolidate complex digital functions onto a single FPGA, reduce board-level component count, and maintain a compact PCB footprint while using a RoHS-compliant, surface-mount package.

Request a quote or submit an RFQ for the 5SGXMA4K1F35C2LN to receive pricing, lead-time, and availability information.