5SGXMA4H3F35I3G

The 5SGXMA4H3F35I3G is a Stratix V GX FPGA from Intel, delivering high-density programmable logic and on-chip memory in a 1152‑FBGA (35×35) FCBGA package. This industrial‑grade device combines a large logic capacity and substantial embedded RAM with high I/O density and low-voltage core operation.

Designed for applications that require extensive programmable logic, significant embedded memory, and multi‑hundred I/O counts, the device targets system-level designs where integration, thermal range, and supply flexibility matter.

Key Features

• Core Logic 420,000 logic elements and 158,500 LABs provide a very large programmable fabric for complex logic implementation.
• Embedded Memory Approximately 37.9 Mbits of on‑chip RAM to support large buffering, lookup tables, and state storage.
• I/O Density 600 device I/Os enable extensive external interface connectivity and parallel system-level integration.
• Transceiver Capability (Series) Stratix V GX family documentation specifies multiple transceiver speed grades for GX devices, enabling high-speed serial channel options within the Stratix V GX family.
• Power and Supply Core voltage supply range of 0.820 V to 0.880 V to match system power domains and optimize core performance.
• Package and Mounting 1152‑BBGA (1152‑FBGA, 35×35) FCBGA package with surface‑mount mounting suitable for high‑density PCB designs.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
• Compliance RoHS compliant.

Typical Applications

• High-speed serial interfaces — Leverage the Stratix V GX transceiver capabilities (series-specific speed grades) for serial connectivity and multi‑Gbps channel implementations.
• Large-scale programmable logic systems — Use the 420k logic elements and extensive on‑chip RAM for complex state machines, protocol processing, and custom accelerators.
• High‑I/O integration — The 600 I/Os support systems requiring many parallel links or diverse peripheral connections.

Unique Advantages

• Extensive logic capacity: 420,000 logic elements enable consolidation of large logic functions into a single device, reducing BOM and board area.
• Significant embedded memory: Approximately 37.9 Mbits of on‑chip RAM supports deep buffering and data path acceleration without external memory dependencies.
• High I/O count: 600 I/Os provide the connectivity needed for dense system interfaces and parallel peripheral integration.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in thermally demanding environments.
• Package suited for dense designs: 1152‑FBGA (35×35) FCBGA package offers a compact, high‑pin‑count solution optimized for surface‑mount assembly.
• Optimized core voltage range: 0.820–0.880 V supply range aligns with low‑voltage core domains to manage power and performance tradeoffs.

Why Choose 5SGXMA4H3F35I3G?

The 5SGXMA4H3F35I3G positions itself as a high‑capacity Stratix V GX FPGA suitable for designs that require a large logic fabric, significant on‑chip memory, and substantial I/O connectivity within an industrial temperature envelope. Its package and supply requirements make it appropriate for compact, high‑pin‑count system boards where integration and reliability are priorities.

For teams building advanced communication links, protocol engines, or compute‑intensive FPGA subsystems, this device offers the combination of resources and environmental range needed for scalable, long‑life deployments backed by Intel’s Stratix V device family documentation and support.

Request a quote or submit a sales inquiry to evaluate 5SGXMA4H3F35I3G for your next high‑density FPGA design.