5SGXMA4H3F35C4N

The 5SGXMA4H3F35C4N is a Stratix V GX family field programmable gate array (FPGA) from Intel (Altera) designed for high-density, high-performance logic integration. This commercial-grade device combines large programmable logic capacity, substantial on-chip memory, and a high I/O count in a 1152-BBGA FCBGA package.

Engineered for complex digital designs, the device is suited to applications that require abundant logic resources, significant embedded RAM, and flexible I/O. As a member of the Stratix V GX family, device-level datasheet material for the family documents advanced transceiver and I/O capabilities available across the family.

Key Features

• Large logic capacity — 420,000 logic elements to implement wide parallel datapaths, state machines, and custom accelerators.
• Embedded memory — Approximately 38 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• High I/O count — 600 I/O pins to support dense connectivity with external devices and multi-channel interfaces.
• Power supply range — Core supply voltage range from 820 mV to 880 mV for core power planning and regulator selection.
• Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature.
• Package — 1152-ball BBGA FCBGA (supplier package listed as 1152-FBGA, 35 × 35 mm) to support high pin-count board layouts.
• Standards compliance — RoHS compliant as specified in the product data.

Typical Applications

• High-density digital processing — Use the device’s 420,000 logic elements and embedded RAM to implement complex signal processing chains and custom compute blocks.
• Multi-channel I/O aggregation — 600 I/Os enable aggregation and routing for systems that require many peripheral connections or parallel data lanes.
• Memory-intensive designs — Approximately 38 Mbits of embedded memory supports large buffering, deep FIFOs, and on-chip data staging for streaming applications.

Unique Advantages

• Substantial programmable logic: 420,000 logic elements provide the capacity to integrate multiple functions on a single device, reducing board-level complexity.
• Significant on-chip RAM: Approximately 38 Mbits of embedded memory lowers reliance on external memory for many buffering and storage tasks.
• High I/O density: 600 I/Os simplify integration with multi-channel sensors, transceivers, and parallel interfaces without adding external I/O expanders.
• Commercial temperature suitability: Rated 0 °C to 85 °C for applications targeting standard commercial environments.
• High-density package: 1152-ball BBGA (35 × 35 mm supplier package) supports compact, high-pin-count board designs.
• RoHS compliant: Meets environmental compliance needs for many commercial product lines.

Why Choose 5SGXMA4H3F35C4N?

The 5SGXMA4H3F35C4N positions itself as a high-capacity, commercially rated Stratix V GX FPGA option for designs that require extensive logic, substantial on-chip memory, and broad I/O connectivity in a single-package solution. Its specifications support integration of large custom logic blocks and memory-intensive functions while simplifying system-level I/O routing.

This device is well suited for development teams and systems integrators building complex digital subsystems that benefit from on-chip resources and a high pin-count package. Selection of this part offers scalability across the Stratix V family and aligns with projects that target commercial temperature ranges and RoHS compliance.

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