5SGXMA4H3F35C3G

The 5SGXMA4H3F35C3G is a Stratix V GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers very large logic capacity and on-chip memory in a surface-mount FCBGA footprint.

With 420,000 logic elements, approximately 37.9 Mbits of embedded RAM and 600 general-purpose I/O pins, this device is suited to designs that require substantial programmable logic, abundant embedded memory and a high I/O count while operating within a commercial temperature envelope.

Key Features

• Core capacity  420,000 logic elements provide extensive programmable logic for complex custom accelerators, signal processing pipelines and large state machines.
• Embedded memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, look-up tables and storage for algorithmic workloads.
• I/O density  600 user I/O pins enable extensive peripheral, board-level and mezzanine interfacing for systems with many external connections.
• Power supply  Core voltage range is specified at 820 mV to 880 mV, enabling designs that target low-voltage core operation and power budgeting.
• Package and mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount device simplifies board-level integration for compact, high-density PCBs.
• Operating grade and temperature  Commercial grade device rated for 0°C to 85°C operation for typical commercial and lab environments.
• Standards compliance  RoHS-compliant material status supports regulatory and environmental requirements for lead-free assemblies.

Typical Applications

• High-density compute and acceleration  Large logic capacity and embedded RAM make this device suitable for hardware acceleration, custom compute blocks and algorithm offload.
• Data-path and packet processing  High I/O count and substantial on-chip memory support complex data-path implementations and buffering required in packet handling and signal processing.
• Prototyping and system integration  Extensive programmable resources allow development and validation of system architectures before committing to ASIC implementations.
• Custom digital signal processing  Abundant logic and memory support implementation of fixed- and floating-point DSP pipelines within a single device.

Unique Advantages

• High logic and memory density:  420,000 logic elements combined with approximately 37.9 Mbits of embedded RAM gives designers headroom for large designs without partitioning across multiple devices.
• Large I/O capability:  600 I/O pins enable extensive interfacing options for multi-channel systems and complex board topologies.
• Compact, high-ball-count package:  1152-ball FCBGA (35×35) consolidates a large FPGA into a compact footprint for space-constrained boards.
• Low-voltage core operation:  Specified 820 mV–880 mV core supply range supports designs targeting power efficiency at the core level.
• Commercial temperature readiness:  Rated 0°C to 85°C for commercial deployments and lab use.
• RoHS compliant:  Conforms to lead-free manufacturing requirements for modern electronics production.

Why Choose 5SGXMA4H3F35C3G?

The 5SGXMA4H3F35C3G positions itself as a high-capacity Stratix V GX FPGA for designs that demand large programmable logic resources, substantial on-chip RAM and a high number of I/O. Its FCBGA package and surface-mount mounting make it suitable for compact, board-level integration where space and pin count matter.

This device is well suited to engineering teams building complex digital systems—such as compute accelerators, signal processing platforms and advanced prototyping—who need a scalable, high-density FPGA option within commercial temperature and low-voltage core constraints.

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