5SGXMA4H3F35C2N

The 5SGXMA4H3F35C2N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel designed for high-density, configurable logic implementations. It provides a large core of programmable logic, substantial embedded memory, and extensive I/O in a compact surface-mount 1152-BBGA (35×35) package. This commercial-grade device targets designs that require high logic capacity, significant on-chip RAM, and broad board-level interfacing.

Key Features

• Logic Capacity  Approximately 420,000 logic elements for implementing complex custom logic, datapaths, and hardware accelerators.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support frame buffers, FIFOs, and local data storage without external memory for many functions.
• Rich I/O  600 I/O pins to support extensive peripheral connections, parallel buses, and multi-channel interfaces on board-level designs.
• Package and Mounting  1152-BBGA (FCBGA) / 1152-FBGA (35×35) package in a surface-mount form factor for dense PCB layouts and compact system integration.
• Power and Core Voltage  Core supply range from 870 mV to 930 mV, enabling predictable core power delivery and design planning for power rails.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for standard commercial-environment applications.
• Standards Compliance  RoHS compliant to meet common regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• High-density logic integration  Use the ~420,000 logic elements to implement complex state machines, custom processors, and parallel datapaths.
• Embedded memory–intensive designs  Leverage approximately 37.9 Mbits of on-chip RAM for buffering, packet queues, and local storage to reduce external memory dependency.
• I/O-heavy systems  Deploy the 600 available I/Os for multi-channel sensor interfaces, wide parallel buses, and extensive board-level connectivity.
• Compact board designs  The 1152-BBGA surface-mount package enables high-density PCBs where space and routing are constrained.

Unique Advantages

• High logic density: Enables consolidation of multiple functions into a single device, reducing component count and board complexity.
• Significant on-chip RAM: Large embedded memory capacity supports local data buffering and reduces the need for external memory in many designs.
• Broad I/O availability: 600 I/Os allow flexible interfacing options and support for mixed-signal front-end connections and wide buses.
• Commercial-grade operating range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Compact package: 1152-BBGA (35×35) footprint supports dense system integration while maintaining high pin count.
• Regulatory alignment: RoHS compliant to support lead-free manufacturing requirements.

Why Choose 5SGXMA4H3F35C2N?

This Stratix V GX FPGA balances very high logic capacity and substantial embedded memory with a large I/O complement in a compact surface-mount package, making it well suited to developers who need to consolidate complex hardware functions and heavy I/O requirements into a single device. As a commercial-grade Intel Stratix V family device, it is documented in the Stratix V device datasheet for electrical and switching characteristics, helping engineers plan power, timing, and thermal constraints precisely.

Choose the 5SGXMA4H3F35C2N for designs that demand large programmable logic resources, significant on-chip RAM, and wide board-level connectivity while maintaining a compact PCB footprint and RoHS compliance.

Request a quote or submit a procurement inquiry to receive pricing and availability for the 5SGXMA4H3F35C2N.