5SGXMA4H3F35C2G

The 5SGXMA4H3F35C2G is an Intel Stratix V GX family FPGA delivering high-density programmable logic, extensive embedded memory, and a large I/O complement in a compact FCBGA package. It combines 420,000 logic elements with approximately 37.9 Mbits of on-chip RAM to support complex, memory‑intensive designs.

Targeted at designs that require high logic capacity and broad I/O connectivity, this commercial-grade device features a 1152‑FBGA (35×35) surface‑mount package and a core supply range of 870 mV to 930 mV, making it suitable for demanding board‑level FPGA implementations within standard commercial temperature environments.

Key Features

• Core Logic — 420,000 logic elements provide substantial programmable fabric for complex control, datapath, and custom accelerator implementations.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, lookup tables, and on‑chip data storage needs.
• I/O Density — 600 user I/Os enable extensive peripheral interfacing and high‑pin-count system integration.
• Power — Core voltage supply specified from 870 mV to 930 mV for the device core.
• Package & Mounting — 1152‑FBGA (35×35) package in an FCBGA form factor; surface‑mount mounting type for board‑level assembly.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant material status.

Typical Applications

• High‑density compute and accelerators — Use the large logic fabric and embedded RAM to implement custom datapaths and on‑chip accelerators.
• High‑I/O communication systems — 600 I/Os provide the connectivity needed for complex protocol bridging, aggregation, and multi‑lane interfaces.
• Board‑level integration — Compact 1152‑FBGA package supports high integration on space‑constrained PCBs while maintaining a high pin count.

Unique Advantages

• Large programmable fabric: 420,000 logic elements let you consolidate complex logic into a single device and reduce external component count.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM minimizes dependency on external memory for many buffering and state‑storage tasks.
• Extensive I/O capability: 600 user I/Os enable flexible partitioning of interfaces and parallel data paths without multiplexing compromises.
• Compact, high‑pin package: 1152‑FBGA (35×35) balances high integration density with board routing practicality for advanced PCB designs.
• Commercial ready: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliant: Meets material compliance expectations for modern product assemblies.

Why Choose 5SGXMA4H3F35C2G?

The 5SGXMA4H3F35C2G positions itself as a high‑capacity Stratix V GX FPGA solution for engineers building logic‑ and memory‑intensive systems that also require broad external connectivity. Its combination of 420,000 logic elements, substantial embedded RAM, and 600 I/Os in a 1152‑FBGA surface‑mount package provides designers with the room to implement complex, integrated functions on a single device.

For teams focused on compact board integration and high channel counts within commercial temperature ranges, this device offers a clear, spec‑driven foundation. Consult the Stratix V device documentation for family‑level electrical and transceiver details and to verify speed‑grade options for your specific design goals.

Request a quote or submit a pricing inquiry to start integrating 5SGXMA4H3F35C2G into your next design.