5SGXMA4H2F35I3N

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 345 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H2F35I3N – Stratix® V GX FPGA, 1152-BBGA FCBGA

The 5SGXMA4H2F35I3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, provided in a 1152-BBGA (1152-FBGA, 35×35) package for surface-mount applications. It combines high logic density, abundant I/O, and substantial on-chip RAM to support complex digital designs that require integration of large amounts of programmable logic and memory.

Designed for industrial temperature operation, this device targets high-density systems that need multi‑gigabit transceiver capability, broad I/O count, and tight power/voltage operating windows for consistent system behavior.

Key Features

  • High logic density — Approximately 420,000 logic elements to implement large-scale digital designs and complex logic functions.
  • Embedded memory — Approximately 37.9 Mbits of on‑chip RAM for buffering, lookup tables, and data storage close to logic.
  • Extensive I/O — 600 user I/O pins to support wide parallel buses, multiple interfaces, or large connector arrays.
  • Multi‑gigabit transceiver grades — Stratix V GX transceiver speed grades are supported; device documentation lists GX channel operation up to 14.1 Gbps with additional grades at 12.5 Gbps and 8.5 Gbps depending on selected speed grade.
  • Package and mounting — 1152-BBGA FCBGA package (supplier device package: 1152-FBGA 35×35) with surface-mount compatibility for compact board integration.
  • Industrial temperature grade — Rated for operation from −40 °C to 100 °C, suitable for temperature-challenging installations.
  • Core voltage range — Core supply specified between 820 mV and 880 mV for clear VIH/ VIL and power budgeting during system design.

Typical Applications

  • High‑speed serial communications — Use the Stratix V GX transceiver grades to implement multi‑gigabit links, protocol bridging, or line card functions requiring high serial throughput.
  • High‑density logic integration — Leverage ~420k logic elements and abundant I/O for system consolidation, hardware acceleration, or complex digital signal processing blocks.
  • Memory‑intensive designs — Utilize approximately 37.9 Mbits of embedded RAM for packet buffering, large FIFOs, or on‑chip data structures to minimize external memory dependence.
  • Industrial systems — The industrial temperature rating (−40 °C to 100 °C) and robust packaging suit deployments in factory automation, instrumentation, and other industrial use cases.

Unique Advantages

  • Large programmable fabric: Approximately 420,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Significant on‑chip memory: Nearly 38 Mbits of embedded RAM supports deep buffering and local data processing to improve latency and throughput.
  • Broad I/O capability: 600 I/O pins allow flexible interfacing with peripherals, mezzanine cards, and wide parallel buses without immediate need for external expanders.
  • Configurable transceiver performance: Stratix V GX transceiver speed grades provide options for multi‑gigabit connectivity tailored to system bandwidth requirements.
  • Industrial temperature operation: Specified −40 °C to 100 °C operation provides a predictable thermal envelope for designs deployed outside controlled environments.
  • Compact BGA packaging: The 1152‑FBGA (35×35) package delivers a dense pinout in a compact footprint for space-constrained PCBs.

Why Choose 5SGXMA4H2F35I3N?

The 5SGXMA4H2F35I3N positions itself where high logic capacity, substantial embedded memory, and extensive I/O intersect with multi‑gigabit transceiver capability and industrial temperature operation. It is suited for designers who need to integrate complex digital systems into a single FPGA footprint while managing power and supply constraints defined by its 0.82–0.88 V core supply range.

As a member of the Stratix V GX family, the device is accompanied by documented electrical and switching characteristics to guide system-level design choices, making it appropriate for engineering teams building demanding communications, processing, or industrial control systems that require deterministic behavior and high integration.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMA4H2F35I3N.

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