5SGXMA4H2F35I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 345 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4H2F35I3N – Stratix® V GX FPGA, 1152-BBGA FCBGA
The 5SGXMA4H2F35I3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, provided in a 1152-BBGA (1152-FBGA, 35×35) package for surface-mount applications. It combines high logic density, abundant I/O, and substantial on-chip RAM to support complex digital designs that require integration of large amounts of programmable logic and memory.
Designed for industrial temperature operation, this device targets high-density systems that need multi‑gigabit transceiver capability, broad I/O count, and tight power/voltage operating windows for consistent system behavior.
Key Features
- High logic density — Approximately 420,000 logic elements to implement large-scale digital designs and complex logic functions.
- Embedded memory — Approximately 37.9 Mbits of on‑chip RAM for buffering, lookup tables, and data storage close to logic.
- Extensive I/O — 600 user I/O pins to support wide parallel buses, multiple interfaces, or large connector arrays.
- Multi‑gigabit transceiver grades — Stratix V GX transceiver speed grades are supported; device documentation lists GX channel operation up to 14.1 Gbps with additional grades at 12.5 Gbps and 8.5 Gbps depending on selected speed grade.
- Package and mounting — 1152-BBGA FCBGA package (supplier device package: 1152-FBGA 35×35) with surface-mount compatibility for compact board integration.
- Industrial temperature grade — Rated for operation from −40 °C to 100 °C, suitable for temperature-challenging installations.
- Core voltage range — Core supply specified between 820 mV and 880 mV for clear VIH/ VIL and power budgeting during system design.
Typical Applications
- High‑speed serial communications — Use the Stratix V GX transceiver grades to implement multi‑gigabit links, protocol bridging, or line card functions requiring high serial throughput.
- High‑density logic integration — Leverage ~420k logic elements and abundant I/O for system consolidation, hardware acceleration, or complex digital signal processing blocks.
- Memory‑intensive designs — Utilize approximately 37.9 Mbits of embedded RAM for packet buffering, large FIFOs, or on‑chip data structures to minimize external memory dependence.
- Industrial systems — The industrial temperature rating (−40 °C to 100 °C) and robust packaging suit deployments in factory automation, instrumentation, and other industrial use cases.
Unique Advantages
- Large programmable fabric: Approximately 420,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
- Significant on‑chip memory: Nearly 38 Mbits of embedded RAM supports deep buffering and local data processing to improve latency and throughput.
- Broad I/O capability: 600 I/O pins allow flexible interfacing with peripherals, mezzanine cards, and wide parallel buses without immediate need for external expanders.
- Configurable transceiver performance: Stratix V GX transceiver speed grades provide options for multi‑gigabit connectivity tailored to system bandwidth requirements.
- Industrial temperature operation: Specified −40 °C to 100 °C operation provides a predictable thermal envelope for designs deployed outside controlled environments.
- Compact BGA packaging: The 1152‑FBGA (35×35) package delivers a dense pinout in a compact footprint for space-constrained PCBs.
Why Choose 5SGXMA4H2F35I3N?
The 5SGXMA4H2F35I3N positions itself where high logic capacity, substantial embedded memory, and extensive I/O intersect with multi‑gigabit transceiver capability and industrial temperature operation. It is suited for designers who need to integrate complex digital systems into a single FPGA footprint while managing power and supply constraints defined by its 0.82–0.88 V core supply range.
As a member of the Stratix V GX family, the device is accompanied by documented electrical and switching characteristics to guide system-level design choices, making it appropriate for engineering teams building demanding communications, processing, or industrial control systems that require deterministic behavior and high integration.
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