5SGXMA4H2F35I3G

The 5SGXMA4H2F35I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable fabric with substantial embedded memory and a large I/O count, packaged in a 1152-ball FCBGA.

Designed for demanding industrial environments, this Stratix V GX device combines large logic capacity and on-chip RAM with family-level support for high-speed transceiver options (see datasheet for transceiver speed grade details), making it suitable for complex logic, buffering, and multi-gigabit serial interfaces.

Key Features

• Core density  Approximately 420,000 logic elements to implement densely packed digital logic and custom accelerators.
• Embedded memory  Approximately 38 Mbits of on-chip RAM to support large FIFOs, buffers, and local data storage for logic-intensive designs.
• High I/O count  600 user I/Os provide extensive connectivity options for parallel interfaces, control signals, and board-level routing.
• High-speed transceiver family options  As a Stratix V GX device, the family datasheet specifies GX channel speed grades up to family-defined multi-gigabit rates depending on speed grade.
• Power and core supply  Core supply range of 820 mV to 880 mV, enabling predictable core-power provisioning in system power budgets.
• Industrial temperature and grade  Rated industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
• Package and mounting  1152-ball FCBGA package (supplier device package: 1152-FBGA (35×35)) with surface-mount mounting for compact board integration.
• Regulatory status  RoHS compliant.

Typical Applications

• High-speed serial communications  Use family-level GX transceiver options (refer to the Stratix V datasheet) to implement multi-gigabit links for networking and telecom interfaces.
• Industrial control and automation  Industrial temperature rating and robust I/O count make the device suitable for complex control logic, motion control, and factory automation systems.
• High-density logic and buffering  Large logic capacity and approximately 38 Mbits of embedded memory support packet buffering, protocol processing, and compute offload functions.

Unique Advantages

• High integration density: Consolidate functions on-chip with roughly 420,000 logic elements and substantial embedded RAM, reducing external component count.
• Large I/O resource: 600 I/Os enable flexible interfacing to peripherals, parallel buses, and board-level connectors without external expanders.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
• Compact FCBGA package: 1152-ball FCBGA (supplier 1152-FBGA (35×35)) balances high pin count with a surface-mount footprint for modern PCB designs.
• Predictable core power envelope: Core supply specification of 0.82–0.88 V supports accurate power budgeting and thermal planning.
• Standards-aligned compliance: RoHS compliance simplifies regulatory tracking for systems requiring restricted-substance adherence.

Why Choose 5SGXMA4H2F35I3G?

The 5SGXMA4H2F35I3G offers a combination of large programmable logic fabric, significant embedded memory, and a high I/O count in a compact FCBGA package, targeted for industrial applications that require robust operation across a wide temperature range. As a Stratix V GX family device, it aligns with series-level high-speed transceiver capabilities and the electrical characteristics documented in the family datasheet.

This device is well suited for designers building complex digital systems that need on-chip memory, large logic resources, and extensive I/O in industrial environments—providing a scalable platform for high-density logic, buffering, and multi-gigabit interfaces.

Request a quote or submit an inquiry to evaluate 5SGXMA4H2F35I3G for your next design project.