5SGXMA4H2F35I3LN

The 5SGXMA4H2F35I3LN is an Intel Stratix V GX field programmable gate array provided in a 1152-ball FBGA (35×35) surface-mount package. It delivers a large programmable fabric—420,000 logic elements—paired with approximately 37.9 Mbits of embedded memory and 600 I/Os for high-density, flexible digital designs.

Designed as an industrial-grade device, the part is specified for operation from –40°C to 100°C and operates with a core voltage supply range of 820 mV to 880 mV. The Stratix V device family datasheet covers detailed electrical and switching characteristics for system integration and performance tuning.

Key Features

• Logic Capacity — 420,000 logic elements provide substantial on-chip programmable resources for complex digital designs and parallel processing pipelines.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, real-time data processing, and large state machines.
• I/O Density — 600 I/Os to support extensive peripheral interfacing, wide parallel buses, and multi-channel connectivity.
• Package & Mounting — 1152-BBGA / 1152-FBGA (35×35) surface-mount package suitable for high-density PCB layouts.
• Power Supply — Core voltage specified at 820 mV to 880 mV to enable optimized power provisioning and core performance balancing.
• Industrial Temperature Range — Rated for −40°C to 100°C operation to meet demanding environmental conditions.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Use the 420,000 logic elements and ~37.9 Mbits of embedded memory for compute-intensive, parallel workloads and custom datapaths.
• Multi-channel I/O systems — 600 general-purpose I/Os enable wide interfacing, front-end aggregation, and complex board-level I/O routing.
• Industrial control and instrumentation — Industrial temperature rating (−40°C to 100°C) and surface-mount packaging support robust embedded control systems in harsh environments.

Unique Advantages

• Large programmable fabric: 420,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM supports deeper buffering and state retention without external memory.
• High I/O count: 600 I/Os simplify board-level design for applications requiring many interfaces or parallel lanes.
• Industrial-grade thermal range: Specified operation from −40°C to 100°C helps ensure reliability in temperature-extreme deployments.
• Compact, high-density package: 1152-ball FBGA (35×35) enables dense PCB integration while supporting a surface-mount workflow.
• RoHS compliant: Meets common environmental restrictions for lead-free assembly processes.

Why Choose 5SGXMA4H2F35I3LN?

The 5SGXMA4H2F35I3LN offers a high-capacity Stratix V GX FPGA solution that combines extensive logic resources, sizable embedded memory, and a large I/O complement in a compact 1152-FBGA package. Its industrial temperature rating and defined core voltage range make it suitable for demanding production environments that require predictable electrical and thermal behavior.

This part is appropriate for engineers and procurement teams developing high-density digital systems, multi-channel interface platforms, and industrial embedded controllers where consolidation of functionality and on-chip memory are priorities. The Stratix V family datasheet provides the complete electrical and switching characteristics needed for system-level design and validation.

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