5SGXMA4H3F35C2LG

The 5SGXMA4H3F35C2LG is a Stratix V GX field-programmable gate array (FPGA) from Intel, provided in a 1152‑FBGA (35×35) package for surface-mount assembly. It delivers a high density of programmable logic and embedded memory resources for demanding digital designs.

Key device attributes include 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, up to 600 I/Os, and a core voltage supply range of 820 mV to 880 mV. This device is offered in a commercial temperature grade (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Core Logic  420,000 logic elements provide substantial programmable logic capacity for complex algorithms and custom hardware functions.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic tasks.
• High I/O Count  Up to 600 user I/Os to accommodate extensive external interfacing and high-pin-count system integration.
• Power/Fabric Voltage  Specified voltage supply range from 820 mV to 880 mV for the device core.
• Package & Mounting  1152‑BBGA / FCBGA package (supplier device package: 1152‑FBGA, 35×35) designed for surface-mount PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Suitable for designs that require a large number of logic elements and substantial on-chip memory capacity.
• High-pin-count interface platforms  Systems that need many external connections can take advantage of the device’s 600 I/Os.
• Embedded memory–centric designs  Applications that require significant on-chip RAM for buffering or data staging benefit from approximately 37.9 Mbits of embedded memory.
• Commercial electronic equipment  Designed for use in commercial temperature environments (0 °C to 85 °C) and surface-mount assemblies.

Unique Advantages

• High logic integration: 420,000 logic elements consolidate complex functionality into a single device, reducing board-level component count.
• Large embedded memory: Approximately 37.9 Mbits of on-chip RAM supports memory-intensive algorithms without immediate reliance on external memory.
• Extensive I/O capacity: 600 I/Os enable flexible system routing and multiple peripheral connections from a single FPGA.
• Compact, production-ready packaging: 1152‑FBGA (35×35) package supports high-density PCB layouts and surface-mount manufacturing processes.
• Commercial-grade readiness: Rated operation from 0 °C to 85 °C for deployment in commercial electronic products.
• Regulatory compliance: RoHS compliance simplifies environmental regulatory alignment for product development.

Why Choose 5SGXMA4H3F35C2LG?

The 5SGXMA4H3F35C2LG delivers a balanced combination of high logic density, significant embedded memory, and broad I/O capability in a single Stratix V GX FPGA. Its package and surface-mount form factor suit compact, production-oriented PCB designs while the commercial temperature rating supports mainstream electronic applications.

Engineers and system designers seeking a high-capacity, RoHS-compliant FPGA with a defined core voltage range and robust I/O density will find this device well-suited for consolidating complex digital functions and reducing BOM complexity.

Request a quote or submit a quote request for part number 5SGXMA4H3F35C2LG to begin procurement and integration planning.