5SGXMA4H3F35C2WN

The 5SGXMA4H3F35C2WN is a Stratix® V GX field-programmable gate array (FPGA) offering high programmable logic capacity and substantial on‑chip memory for demanding designs. As a commercial‑grade Stratix V GX device in a high‑pin‑count FCBGA package, it is intended for applications that require large logic density, extensive I/O, and significant embedded RAM.

Key value comes from combining 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 600 available I/O in a 1152‑BBGA (35×35) surface‑mount package, with a core voltage supply range of 870 mV to 930 mV and a commercial operating range of 0 °C to 85 °C.

Key Features

• Programmable Logic Capacity  420,000 logic elements provide large-scale programmable resources for complex logic, DSP, and control functions.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support buffers, lookup tables, and intermediate data storage without external memory.
• I/O Density  600 user I/O pins accommodate high channel counts and broad peripheral connectivity in I/O‑intensive designs.
• Package and Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for high‑pin‑count board designs.
• Power Supply  Core voltage supply range from 870 mV to 930 mV to match system power architectures and voltage regulators.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Communications & Networking  High I/O count and large logic capacity support protocol processing, packet handling, and network interface implementations.
• Data Processing & Acceleration  Substantial logic resources and on‑chip RAM make the device suitable for compute‑intensive acceleration and custom data‑path implementations.
• Signal Processing  Embedded memory and extensive programmable logic enable multi‑channel DSP, filtering, and aggregation tasks.
• Prototyping & System Integration  High density logic and I/O facilitate hardware prototyping and integration of complex subsystems onto a single FPGA package.

Unique Advantages

• High Logic Density: 420,000 logic elements let you implement complex state machines, datapaths, and parallel processing pipelines on a single device.
• Large On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM reduces reliance on external memory and simplifies board design for many buffering and storage needs.
• Extensive I/O: 600 I/O pins provide flexibility for interfacing to high channel counts, multiple peripherals, and diverse signaling domains.
• Compact, High‑Pin Package: 1152‑BBGA (35×35) FCBGA packaging delivers high interconnect density in a surface‑mount form factor for space‑constrained PCB layouts.
• Commercial‑Grade Availability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose 5SGXMA4H3F35C2WN?

The 5SGXMA4H3F35C2WN combines large programmable logic capacity, significant on‑chip memory, and high I/O density in a single Stratix V GX FPGA package, making it a strong choice for developers implementing complex, I/O‑heavy designs. Its 1152‑BBGA surface‑mount package and defined core voltage range support integration into high‑performance boards while maintaining predictable commercial‑grade thermal and environmental characteristics.

This device is well suited for engineering teams and procurement for projects that need scalable logic resources, integrated memory, and high connectivity on a single FPGA fabric while adhering to commercial operating and RoHS environmental requirements.

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