5SGXMA4H3F35C3WN

The 5SGXMA4H3F35C3WN is a Stratix® V GX field-programmable gate array supplied in a 1152-ball BGA package. It delivers very high logic capacity and embedded memory with extensive I/O resources for demanding commercial applications.

Designed for commercial temperature operation, this device combines 420,000 logic elements with approximately 37.9 Mbits of on-chip RAM and 600 I/O pins, offering a platform for high-density digital integration, system-level consolidation, and complex interface requirements.

Key Features

• Logic Capacity  420,000 logic elements for implementing large-scale, complex digital designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage without external memory.
• I/O Resources  600 I/O pins to accommodate multiple high-pin-count interfaces and board-level connectivity.
• Package  1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35 mm) for dense board integration and reliable solder connections.
• Power Supply  Voltage supply range of 820 mV to 880 mV, enabling operation within the specified core supply window.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliance  RoHS-compliant manufacturing to meet common environmental and regulatory requirements.

Typical Applications

• High-density digital systems  Use the large logic element count and on-chip RAM to consolidate multiple functions into a single programmable device.
• Interface aggregation  Leverage 600 I/Os to aggregate multiple parallel and serial interfaces on a single FPGA for system integration.
• Prototyping and development  Implement complex algorithms and system prototypes where high logic capacity and abundant embedded memory are required.

Unique Advantages

• High logic density: 420,000 logic elements enable large-scale designs and feature-rich implementations without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces reliance on external memory, simplifying board design and improving data locality.
• Extensive I/O count: 600 I/Os support complex board-level interfacing, multiple peripherals, and parallel bus architectures.
• Compact BGA package: 1152-ball FBGA (35×35 mm) provides a small footprint for high-density PCBs while supporting robust solder connections.
• Commercial temperature rating: Rated 0 °C to 85 °C to match standard commercial deployment environments.
• Standards-friendly manufacturing: RoHS compliance facilitates integration into mainstream product supply chains.

Why Choose 5SGXMA4H3F35C3WN?

The 5SGXMA4H3F35C3WN positions itself as a high-capacity, commercial-grade Stratix V GX FPGA for designs that require significant logic resources, plentiful embedded memory, and broad I/O capability in a single device. Its BGA package and RoHS compliance make it suitable for compact, production-oriented board designs.

This device is well suited to system designers and engineers building complex digital systems who need to consolidate functionality, reduce external memory dependence, and manage large interface counts while operating within standard commercial temperature ranges.

Request a quote or submit an inquiry for 5SGXMA4H3F35C3WN to receive pricing and availability information tailored to your project requirements.