5SGXMA4H2F35I2WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 219 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H2F35I2WN – Stratix® V GX FPGA IC — 420,000 logic elements, ~37.9 Mbits RAM, 600 I/O, 1152-BBGA

The 5SGXMA4H2F35I2WN is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It provides 420,000 logic elements and approximately 37.9 Mbits of embedded memory, paired with 600 user I/O pins to support complex, high-density digital designs.

Engineered for industrial temperature operation and produced for surface-mount assembly, this device targets applications that require substantial on-chip logic and memory capacity together with broad I/O connectivity.

Key Features

  • Core logic density — 420,000 logic elements to implement large-scale digital designs and complex custom logic functions.
  • Embedded memory — Approximately 37.9 Mbits of on-chip RAM for buffering, packet processing, and state storage without external memory.
  • I/O capacity — 600 user I/O pins to support high channel counts, wide data buses, and extensive peripheral interfacing.
  • Transceiver options (series-level) — Stratix V GX series transceiver speed grades include options up to 14.1 Gbps per the device family datasheet.
  • Power and core voltage — Core supply range specified at 870 mV to 930 mV for defined operating conditions.
  • Package and mounting — 1152-BBGA (35 × 35) FCBGA package, surface-mount design suitable for modern PCB assembly processes.
  • Temperature and grade — Industrial grade operation with specified temperature range of −40 °C to 100 °C.
  • Regulatory status — RoHS compliant.

Unique Advantages

  • High logic capacity: 420,000 logic elements allow large, consolidated designs to be implemented on a single device, reducing system complexity.
  • Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM minimizes external memory dependencies for many buffering and processing tasks.
  • Extensive I/O: 600 I/O pins enable broad peripheral connectivity and support for wide parallel interfaces.
  • Industrial temperature range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Standard FCBGA package: 1152-BBGA (35×35) facilitates dense PCB integration with surface-mount assembly.
  • Documented series capabilities: Stratix V GX family transceiver speed grades (documented in the device datasheet) provide defined options up to 14.1 Gbps for serial link requirements.

Why Choose 5SGXMA4H2F35I2WN?

The 5SGXMA4H2F35I2WN positions itself as a high-capacity Stratix V GX FPGA option for designs that demand extensive logic resources, significant embedded memory, and a large number of I/O signals within an industrial temperature envelope. Its defined core voltage range and standardized FCBGA package make it suitable for integration into production assemblies that require predictable electrical and mechanical characteristics.

For engineering teams building complex digital systems or consolidating multiple functions onto a single programmable device, this Stratix V GX part delivers a combination of density, on-chip memory, and I/O breadth backed by the device family documentation.

If you’d like pricing, availability, or a formal quote for 5SGXMA4H2F35I2WN, request a quote or submit an inquiry to receive further ordering and supply information.

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