5SGXMA5K2F40I3LN

The 5SGXMA5K2F40I3LN is a Stratix V GX field-programmable gate array (FPGA) in a 1517-ball FCBGA package, offered in an industrial temperature grade. It provides high on-chip resources—approximately 490,000 logic elements and roughly 46 Mbits of embedded memory—designed for complex digital signal processing, high-density logic integration, and I/O-heavy systems.

With 696 user I/Os, a low-voltage core supply range (820 mV–880 mV), and an operating temperature range from –40 °C to 100 °C, this device targets industrial applications that require large logic capacity, significant embedded RAM, and robust thermal performance.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement large-scale digital designs and complex custom logic blocks.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM suitable for buffering, FIFOs, and embedded data storage.
• I/O Capacity  696 user I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Power and Supply  Core voltage supply range of 820 mV to 880 mV for defined power rails and predictable core power planning.
• Package and Mounting  1517-BBGA FCBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for high-density PCB assembly.
• Temperature Grade  Industrial operating range from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant to meet environmentally restricted substance requirements.

Typical Applications

• High-density digital processing  Implement large custom datapaths and parallel processing engines using the device's ~490k logic elements and abundant embedded RAM.
• Multi-channel I/O systems  Leverage 696 user I/Os for dense sensor arrays, wide bus interfaces, or multi-protocol aggregation on a single FPGA.
• Industrial control and automation  Use the industrial temperature rating and robust package to build reliable control logic, motor-control interfaces, or deterministic I/O subsystems.
• Embedded memory-centric designs  Utilize approximately 46 Mbits of on-chip RAM for buffering, packet processing, or streaming data applications.

Unique Advantages

• High logic capacity: Roughly 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant on-chip RAM: Approximately 46 Mbits of embedded memory supports large buffers and complex state machines without external memory.
• Extensive I/O count: 696 I/Os facilitate dense connectivity and flexible interface routing for multi-channel or multi-protocol systems.
• Industrial-grade operation: Rated for –40 °C to 100 °C operation, suitable for industrial environments where extended temperature range is required.
• Compact, surface-mount package: 1517-ball FCBGA (40×40) provides a high I/O/pin density footprint for space-constrained, high-performance boards.
• Regulatory friendliness: RoHS compliance supports designs that must meet restricted-substances requirements.

Why Choose 5SGXMA5K2F40I3LN?

The 5SGXMA5K2F40I3LN combines substantial programmable logic, large embedded memory, and a high-count I/O package in an industrial-grade Stratix V GX device. Its specifications make it well suited for designers who need to integrate complex digital functions, handle large data streams on-chip, and maintain reliable operation across a wide temperature range.

This device is a practical choice for teams building high-density FPGA solutions where consolidation of functionality, predictable power rails, and board-level space efficiency are priorities. Its combination of resources supports scalable designs and long-term deployment in industrial applications.

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