5SGXMA5K3F35C2G

The 5SGXMA5K3F35C2G is an Intel Stratix® V GX field‑programmable gate array supplied in a 1152‑ball BGA (35 × 35 mm) package. Designed as a high‑density commercial‑grade FPGA, this device combines a large logic resource pool and substantial on‑chip memory with a high I/O count for complex, pin‑dense designs.

This device is well suited to applications that require extensive programmable logic, embedded memory, and large I/O capability while operating within a commercial temperature range and a core supply window of 870 mV to 930 mV.

Key Features

• Core and Logic  Approximately 490,000 logic elements to implement complex custom logic, large parallel datapaths, and extensive state machines.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, on‑chip data storage, and local scratchpad memory.
• I/O Capacity  432 user I/O pins to support high‑pin‑count interfaces and board‑level connectivity.
• Package & Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35 mm) in a surface‑mount form factor for compact board integration.
• Power Supply  Core voltage supply range from 870 mV to 930 mV, enabling predictable power provisioning within the specified window.
• Operating Range  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital signal processing  Use the large logic fabric and ~46 Mbits of embedded memory to implement multi‑channel DSP pipelines and custom processing engines.
• Custom logic acceleration  Implement hardware accelerators and offload computational kernels using the extensive programmable logic resources.
• High‑pin‑count system interfaces  Leverage 432 I/O pins for wide parallel buses, complex control interfaces, or multiple peripheral connections on compact boards.

Unique Advantages

• High logic density: Approximately 490,000 logic elements enable large, integrated designs that reduce the need for multiple devices.
• Substantial on‑chip memory: Around 46 Mbits of embedded RAM supports buffering, packet queues, and large local data stores without external memory dependency.
• Generous I/O count: 432 I/O pins accommodate complex, multi‑interface systems and simplify board routing for high‑connectivity designs.
• Compact, industry‑standard package: 1152‑BBGA (35×35 mm) surface‑mount package balances high pin count with a compact PCB footprint.
• Commercial temperature and RoHS compliance: Commercial grade operation (0 °C to 85 °C) with RoHS compliance supports standard commercial product deployments and regulatory requirements.

Why Choose 5SGXMA5K3F35C2G?

The 5SGXMA5K3F35C2G positions itself as a high‑density, commercially graded Stratix V GX FPGA for engineers who need extensive logic capacity, significant on‑chip memory, and a high number of I/O in a single device. Its 1152‑ball BGA package and surface‑mount mounting make it suitable for space‑constrained, high‑function boards while the specified core voltage and temperature range enable predictable system design.

This device is appropriate for teams building complex programmable systems that demand large, integrated logic and memory resources along with robust I/O capability, offering scalability and design consolidation for mid‑to‑high complexity commercial applications.

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