5SGXMA5K3F35C2LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 1,972 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F35C2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA5K3F35C2LN is a Stratix V GX family FPGA from Intel designed for high-density, programmable logic applications. It combines a large logic fabric with substantial on‑chip RAM and a broad I/O count to address complex digital processing and system integration tasks.

Electrical and switching characteristics for Stratix V devices are documented in the device datasheet, which covers operating conditions, power consumption, and I/O timing for this family.

Key Features

  • Logic Capacity  490,000 logic elements and approximately 185,000 logic array blocks provide significant programmable logic resources for complex designs.
  • Embedded Memory  Approximately 46 Mbits of total on‑chip RAM for buffering, state storage, and data manipulation.
  • I/O Density  432 user I/O pins to support broad interfacing and high‑pin-count system requirements.
  • Package  1152‑BBGA FCBGA (supplier: 1152‑FBGA, 35×35) surface‑mount package for compact, high‑density board designs.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV, enabling defined core power budgeting and supply design.
  • Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant, meeting common lead‑free and environmental requirements.

Unique Advantages

  • High integration density: The combination of 490,000 logic elements and ~46 Mbits of embedded RAM reduces the need for external components and simplifies multi‑function designs.
  • Extensive I/O resources: 432 I/Os enable flexible system interfacing and the ability to connect numerous peripherals or high‑speed interfaces without extra bridge logic.
  • Compact, standardized package: The 1152‑BBGA (35×35) FCBGA package provides a high pin count in a space‑efficient footprint for densely packed PCBs.
  • Deterministic power envelope: A clearly defined core supply range (820–880 mV) helps with predictable power architecture and thermal planning.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching standard commercial electronics and system environments.
  • Regulatory readiness: RoHS compliance supports deployments requiring lead‑free components.

Why Choose 5SGXMA5K3F35C2LN?

5SGXMA5K3F35C2LN positions itself as a high‑density Stratix V GX FPGA option for designers who require a large logic fabric, substantial embedded memory, and a high I/O count in a compact BGA package. Its defined core voltage range, commercial temperature rating, and RoHS compliance make it suitable for disciplined, production‑oriented electronic designs within the commercial temperature domain.

The device is supported by the Stratix V family documentation that details electrical and switching characteristics, enabling engineers to plan power, I/O timing, and thermal considerations precisely for robust system designs.

Request a quote or submit a sales inquiry to evaluate 5SGXMA5K3F35C2LN for your next high‑density FPGA design.

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