5SGXMA5K3F35C3N

The 5SGXMA5K3F35C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high logic capacity device architecture with substantial on-chip RAM and a large I/O count, packaged in a 1152-FBGA (35×35) surface-mount FCBGA.

Designed for designs that require extensive programmable logic, significant embedded memory, and many external interfaces, this commercial-grade FPGA provides a deterministic operating-voltage window and a defined commercial temperature range for system integration and deployment.

Key Features

• Core Logic Density  490,000 logic elements (LEs) to implement large-scale programmable logic functions and complex digital systems.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for data buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Count  432 user I/Os to support extensive peripheral connectivity and multi-channel interfacing.
• Power Supply  Operates from 820 mV to 880 mV, providing a specified core voltage range for predictable power design.
• Package & Mounting  1152-FBGA (35×35) package, surface-mount (1152-BBGA, FCBGA) suitable for high-density board layouts.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM enable complex finite-state machines, data path logic, and custom processors.
• Communications and interfacing  High I/O count supports multi-channel interfaces and system routing for network and telecom equipment.
• Signal aggregation and buffering  Substantial embedded RAM provides local storage for packet buffering, staging, and real-time data handling.
• System integration and prototyping  Surface-mount FBGA package and commercial temperature grade make this device suitable for development boards and production prototypes.

Unique Advantages

• Large programmable fabric: 490,000 logic elements let you consolidate multiple functions into a single device and reduce external component count.
• Significant on-chip RAM: Approximately 46.08 Mbits of embedded memory supports deep buffering and state retention without relying on external memories.
• High I/O availability: 432 I/Os simplify board-level routing and enable dense system connectivity for multi-interface designs.
• Defined operating window: Specified core voltage range (820 mV–880 mV) helps streamline power-supply design and validation.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliant: Meets common environmental compliance expectations for modern electronics assemblies.

Why Choose 5SGXMA5K3F35C3N?

The 5SGXMA5K3F35C3N positions itself as a high-density, commercial-grade Stratix V GX FPGA option for designs that require a combination of extensive logic resources, substantial embedded memory, and large I/O capacity. Its defined core voltage range and standard commercial temperature rating support predictable integration into board-level systems.

This device is appropriate for engineering teams implementing complex digital architectures, high-channel interfacing, or on-chip buffering requirements who need a single FPGA with verified specifications and Intel/Altera Stratix V documentation support.

Request a quote or submit an RFQ to inquire about availability, pricing, and lead times for the 5SGXMA5K3F35C3N. Our team can provide procurement details and assist with your order.