5SGXMA5K3F35C4N

The 5SGXMA5K3F35C4N is a Stratix® V GX field programmable gate array (FPGA) IC designed for commercial-grade, high-density digital designs. As a GX-class Stratix V device, it delivers large logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package.

This device targets designs that require extensive on-chip logic and memory resources while maintaining a defined commercial operating temperature and low-voltage core supply. It is supplied in a surface-mount 1152-BBGA package suitable for dense board-level integration.

Key Features

• Logic Capacity  Approximately 490,000 logic elements providing substantive fabric for complex digital functions and large-scale designs.
• Logic Array Blocks  185,000 logic array blocks to structure and distribute logic resources efficiently across the device.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, LUT-based storage, and data-path requirements.
• I/O Resources  432 I/O pins to support wide external connectivity and multiple interfacing requirements on a single device.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35 × 35 mm). Surface-mount mounting type for PCB integration.
• Power  Core voltage supply range of 820 mV to 880 mV for the FPGA core.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Leverage the ~490,000 logic elements and ~46.08 Mbits of embedded memory to implement complex algorithms and large logic networks on-chip.
• I/O-rich system interfaces  With 432 I/Os and a compact 1152-BBGA package, integrate multiple external interfaces and peripherals while conserving board space.
• Custom accelerator and offload functions  Use the device’s large logic fabric and memory to create hardware accelerators and data-path offloads for commercial applications.

Unique Advantages

• Substantial on-chip resources: The combination of ~490,000 logic elements and roughly 46.08 Mbits of embedded RAM enables integration of large logic systems without external memory dependence.
• High I/O density: 432 I/Os allow flexible interfacing and support for multiple parallel channels or mixed-signal front ends on a single FPGA.
• Compact, manufacturable package: The 1152-BBGA (1152-FBGA, 35 × 35 mm) surface-mount package supports dense PCB routing and standard assembly flows.
• Controlled-power core: Core supply range of 820 mV–880 mV provides defined power parameters for system power budgeting and design.
• Commercial operating profile: Rated for 0 °C to 85 °C, matching common commercial-environment deployments and product lifecycles.
• RoHS compliance: Meets lead-free and restricted-substances requirements for environmentally conscious builds.

Why Choose 5SGXMA5K3F35C4N?

The 5SGXMA5K3F35C4N positions itself as a high-density Stratix V GX FPGA option for commercial designs that demand a large logic fabric, significant on-chip memory, and substantial I/O capacity in a single package. Its defined core voltage range and commercial temperature rating make it suitable for production systems where these specific electrical and environmental constraints apply.

Choose this FPGA when your design requires on-chip integration to reduce external components, high I/O parallelism, and the memory and logic resources that support complex algorithm implementation and hardware acceleration within a compact surface-mount 1152-BBGA footprint.

Request a quote or submit an inquiry to obtain availability, pricing, and additional technical support for the 5SGXMA5K3F35C4N.