5SGXMA5K3F35C4WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 176 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K3F35C4WN – Stratix V GX FPGA, 490,000 logic elements, 1152‑BBGA
The 5SGXMA5K3F35C4WN is an Intel Stratix® V GX field‑programmable gate array (FPGA) in a 1152‑FBGA (35×35) package. It provides a large programmable fabric with 490,000 logic elements and approximately 46 Mbits of embedded memory, targeting complex digital designs that require substantial on‑chip logic and memory resources.
Designed as a commercial‑grade Stratix V GX device, this FPGA offers a high I/O count and supported operating conditions suitable for demanding communications and system‑level applications that need dense integration in a surface‑mount FCBGA package.
Key Features
- High Logic Density 490,000 logic elements to support large custom datapaths, state machines, and complex control logic.
- Embedded Memory Approximately 46 Mbits of on‑chip RAM for buffering, lookup tables, and on‑chip data storage.
- Extensive I/O 432 I/O pins to enable broad system interfacing and high pin‑count connectivity options.
- Package and Mounting 1152‑FBGA (35×35) FCBGA package, surface‑mount mounting for compact board integration.
- Power Core supply voltage range of 820 mV to 880 mV to match targeted system power domains.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance.
- Stratix V GX Family Characteristics Part of the Stratix V GX family, which includes devices with high‑performance switching characteristics and configurable transceiver options as described in the device documentation.
Typical Applications
- High‑performance communications systems Use the Stratix V GX fabric and family transceiver capabilities to implement custom packet processing, protocol bridging, or high‑speed I/O aggregation.
- Data processing and acceleration Leverage the large logic capacity and embedded memory for hardware acceleration of compute kernels, streaming data pipelines, and real‑time processing.
- System integration and prototyping Employ the high I/O count and dense FPGA fabric for prototype validation, system glue logic, and integration of complex peripherals.
Unique Advantages
- Substantial programmable resources: 490,000 logic elements and approximately 46 Mbits of embedded memory reduce the need for external logic and memory components.
- High connectivity: 432 I/O pins support complex board‑level I/O requirements and multiple peripheral interfaces without compromises.
- Compact, production‑ready packaging: 1152‑FBGA (35×35) FCBGA surface‑mount package enables high‑density board designs while maintaining manufacturability.
- Controlled power domain: Defined core voltage range (820 mV–880 mV) helps integrators plan power delivery and thermal considerations accurately.
- Commercial grade and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
- Family‑level capabilities: As a Stratix V GX device, it aligns with device documentation that details advanced switching and transceiver features for high‑speed designs.
Why Choose 5SGXMA5K3F35C4WN?
The 5SGXMA5K3F35C4WN delivers a balance of high logic density, substantial embedded memory, and extensive I/O in a production‑grade FCBGA package—making it suitable for complex digital systems that demand on‑chip resources and flexible interfacing. Its defined voltage and temperature specifications simplify integration into commercial systems where reliability and repeatable performance matter.
This part is well suited to engineering teams developing high‑capacity logic designs, data‑processing accelerators, and communication systems that require a programmable, high‑density FPGA fabric with the form factor and specifications to support compact, manufacturable board designs.
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