5SGXMA5K3F35I3G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 16 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F35I3G – Stratix V GX FPGA, approximately 490,000 logic elements, 432 I/O, 1152-FBGA

The 5SGXMA5K3F35I3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, designed for high-density, industrial-grade digital logic applications. This device delivers a substantial logic fabric, significant embedded memory, and a broad I/O count in a 1152-ball FCBGA package for surface-mount PCB designs.

Targeted at systems that require large programmable logic capacity and robust operating conditions, the device provides designers with a high-capacity, field-programmable platform suitable for complex signal processing, protocol bridging, and system integration tasks.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements to implement large-scale custom logic, datapaths, and control functions.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data structures without external memory for many use cases.
  • I/O Density  432 user I/O pins to support wide parallel interfaces, multi-lane connectivity, and complex board-level routing.
  • Operating Voltage  Core supply range specified at 820 mV to 880 mV, enabling precise power provisioning and compatibility with system power rails sized for Stratix V devices.
  • Thermal and Grade  Industrial temperature grade with an operating range of −40°C to 100°C for deployment in demanding thermal environments.
  • Package and Mounting  1152-ball FCBGA (1152-FBGA, 35 × 35) surface-mount package that provides a compact, high-pin-count footprint for dense system designs.
  • Family-Level Transceiver Capability  As a Stratix V GX device, the family supports high-speed transceiver options across various speed grades (family-level detail); designers can refer to device documentation for speed-grade specifics applicable to system requirements.
  • Standards Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

  • High-performance signal processing  Implement large-scale DSP pipelines, filtering, and real-time data manipulation using the device’s extensive logic and embedded memory.
  • Protocol bridging and packet processing  Use abundant logic and I/O to build protocol converters, packet engines, and custom networking blocks that require parallel I/O and on-chip buffering.
  • Multi-lane interface aggregation  Aggregate and route multiple high-pin-count interfaces or parallel data buses for backend aggregation or front-end capture tasks.
  • Industrial control and automation  Deploy in industrial equipment where the device’s industrial temperature grade and robust I/O count support sensor interfacing, motion control logic, and system orchestration.

Unique Advantages

  • High logic density: Approximately 490,000 logic elements allow implementation of extensive custom logic and complex state machines without partitioning across multiple devices.
  • Substantial embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary-storage needs, lowering system BOM complexity.
  • Generous I/O count: 432 user I/O pins enable broad connectivity options for parallel interfaces, sensor networks, and multi-lane data paths.
  • Industrial operating range: Rated for −40°C to 100°C operation to support deployments in temperature-challenging environments.
  • Compact, high-pin-count package: The 1152-ball FCBGA footprint balances density and board-level routing capability for space-constrained, high-performance boards.
  • Manufacturer backing: Part of the Intel Stratix V GX family, with series-level documentation and specifications available for design validation and integration.

Why Choose 5SGXMA5K3F35I3G?

The 5SGXMA5K3F35I3G offers a combination of large programmable logic capacity, significant embedded memory, and robust I/O in an industrial-grade package, making it well suited for complex system designs that demand on-chip resources and reliable operation across a wide temperature range. Its 1152-ball FCBGA package and surface-mount mounting support high-density PCB layouts while enabling extensive connectivity.

This device is oriented toward engineers and system integrators building high-performance signal processing, protocol conversion, and industrial control systems who require a scalable, field-programmable solution with Intel’s Stratix V GX family support and documentation.

Request a quote or submit an inquiry today to evaluate 5SGXMA5K3F35I3G for your next high-density FPGA design project.

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