5SGXMA5K3F35I3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 16 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K3F35I3G – Stratix V GX FPGA, approximately 490,000 logic elements, 432 I/O, 1152-FBGA
The 5SGXMA5K3F35I3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, designed for high-density, industrial-grade digital logic applications. This device delivers a substantial logic fabric, significant embedded memory, and a broad I/O count in a 1152-ball FCBGA package for surface-mount PCB designs.
Targeted at systems that require large programmable logic capacity and robust operating conditions, the device provides designers with a high-capacity, field-programmable platform suitable for complex signal processing, protocol bridging, and system integration tasks.
Key Features
- Logic Capacity Approximately 490,000 logic elements to implement large-scale custom logic, datapaths, and control functions.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data structures without external memory for many use cases.
- I/O Density 432 user I/O pins to support wide parallel interfaces, multi-lane connectivity, and complex board-level routing.
- Operating Voltage Core supply range specified at 820 mV to 880 mV, enabling precise power provisioning and compatibility with system power rails sized for Stratix V devices.
- Thermal and Grade Industrial temperature grade with an operating range of −40°C to 100°C for deployment in demanding thermal environments.
- Package and Mounting 1152-ball FCBGA (1152-FBGA, 35 × 35) surface-mount package that provides a compact, high-pin-count footprint for dense system designs.
- Family-Level Transceiver Capability As a Stratix V GX device, the family supports high-speed transceiver options across various speed grades (family-level detail); designers can refer to device documentation for speed-grade specifics applicable to system requirements.
- Standards Compliance RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.
Typical Applications
- High-performance signal processing Implement large-scale DSP pipelines, filtering, and real-time data manipulation using the device’s extensive logic and embedded memory.
- Protocol bridging and packet processing Use abundant logic and I/O to build protocol converters, packet engines, and custom networking blocks that require parallel I/O and on-chip buffering.
- Multi-lane interface aggregation Aggregate and route multiple high-pin-count interfaces or parallel data buses for backend aggregation or front-end capture tasks.
- Industrial control and automation Deploy in industrial equipment where the device’s industrial temperature grade and robust I/O count support sensor interfacing, motion control logic, and system orchestration.
Unique Advantages
- High logic density: Approximately 490,000 logic elements allow implementation of extensive custom logic and complex state machines without partitioning across multiple devices.
- Substantial embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary-storage needs, lowering system BOM complexity.
- Generous I/O count: 432 user I/O pins enable broad connectivity options for parallel interfaces, sensor networks, and multi-lane data paths.
- Industrial operating range: Rated for −40°C to 100°C operation to support deployments in temperature-challenging environments.
- Compact, high-pin-count package: The 1152-ball FCBGA footprint balances density and board-level routing capability for space-constrained, high-performance boards.
- Manufacturer backing: Part of the Intel Stratix V GX family, with series-level documentation and specifications available for design validation and integration.
Why Choose 5SGXMA5K3F35I3G?
The 5SGXMA5K3F35I3G offers a combination of large programmable logic capacity, significant embedded memory, and robust I/O in an industrial-grade package, making it well suited for complex system designs that demand on-chip resources and reliable operation across a wide temperature range. Its 1152-ball FCBGA package and surface-mount mounting support high-density PCB layouts while enabling extensive connectivity.
This device is oriented toward engineers and system integrators building high-performance signal processing, protocol conversion, and industrial control systems who require a scalable, field-programmable solution with Intel’s Stratix V GX family support and documentation.
Request a quote or submit an inquiry today to evaluate 5SGXMA5K3F35I3G for your next high-density FPGA design project.

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