5SGXMA5K3F35I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 326 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K3F35I3N – Stratix® V GX FPGA, 490,000 logic elements, ~46.08 Mbits RAM, 432 I/O, 1152-FBGA
The 5SGXMA5K3F35I3N is an Intel Stratix® V GX field programmable gate array (FPGA) packaged in a 1152-FBGA (35×35) surface-mount package. It provides large-scale programmable logic, substantial on-chip memory, and a high-density I/O complement suitable for designs that require extensive logic resources and robust I/O capability.
Built and graded for industrial operation, this device is specified with a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, supporting deployment in systems that demand extended temperature operation and reliability.
Key Features
- Logic Capacity 490,000 logic elements (LEs) to implement large, complex digital designs and custom processing pipelines.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM, enabling memory-intensive algorithms and buffering without immediate reliance on external memory.
- High-Density I/O 432 user I/O pins for broad connectivity to peripherals, buses, and external devices.
- Transceiver Capability (Stratix V GX family) Stratix V GX devices include high-speed transceiver options; family documentation lists GX channel speed grades up to 14.1 Gbps for applicable devices in the series.
- Package and Mounting 1152-BBGA / 1152-FBGA (35×35) surface-mount package for high-density board implementations.
- Power and Voltage Core supply specified between 820 mV and 880 mV to match platform power architectures.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- High-speed serial transceiver systems Leverages family transceiver speed grades to implement high-bandwidth serial links and protocol bridging.
- Memory-intensive digital processing Large embedded RAM supports buffering and data-path storage for signal processing or custom compute engines.
- Dense I/O interfacing 432 I/O pins provide the connectivity needed for multi-channel sensor, peripheral, or bus interfacing in complex systems.
- Industrial control and automation Industrial temperature rating and robust packaging support long-term operation in factory and process-control equipment.
Unique Advantages
- Large programmable fabric: 490,000 logic elements enable implementation of extensive custom logic, hardware accelerators, and multi-function designs on a single device.
- Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks, simplifying board-level design.
- High I/O density: 432 I/O pins allow flexible interfacing to numerous peripherals and parallel buses without complex multiplexing.
- Industrial-grade operation: Specified operation from −40 °C to 100 °C and industrial grading help ensure stable performance in demanding environments.
- Compact, high-density package: 1152-FBGA (35×35) package provides a high pin-count solution in a space-efficient BGA form factor.
- Environmentally compliant: RoHS-compliant construction supports regulatory and sustainability requirements.
Why Choose 5SGXMA5K3F35I3N?
This Stratix V GX device combines a very large logic resource pool, substantial embedded memory, and abundant I/O in an industrial-temperature-rated FPGA package. It is suited for engineering teams building complex, memory-rich, and I/O-heavy systems where on-chip resources and reliable operation across a wide temperature range are important design drivers.
Designed for customers requiring scalability and robustness, the 5SGXMA5K3F35I3N aligns with projects that need a high-capacity programmable fabric and high-density integration while maintaining industrial operating margins and RoHS compliance.
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