5SGXMA5K3F35I3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 326 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F35I3N – Stratix® V GX FPGA, 490,000 logic elements, ~46.08 Mbits RAM, 432 I/O, 1152-FBGA

The 5SGXMA5K3F35I3N is an Intel Stratix® V GX field programmable gate array (FPGA) packaged in a 1152-FBGA (35×35) surface-mount package. It provides large-scale programmable logic, substantial on-chip memory, and a high-density I/O complement suitable for designs that require extensive logic resources and robust I/O capability.

Built and graded for industrial operation, this device is specified with a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, supporting deployment in systems that demand extended temperature operation and reliability.

Key Features

  • Logic Capacity  490,000 logic elements (LEs) to implement large, complex digital designs and custom processing pipelines.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM, enabling memory-intensive algorithms and buffering without immediate reliance on external memory.
  • High-Density I/O  432 user I/O pins for broad connectivity to peripherals, buses, and external devices.
  • Transceiver Capability (Stratix V GX family)  Stratix V GX devices include high-speed transceiver options; family documentation lists GX channel speed grades up to 14.1 Gbps for applicable devices in the series.
  • Package and Mounting  1152-BBGA / 1152-FBGA (35×35) surface-mount package for high-density board implementations.
  • Power and Voltage  Core supply specified between 820 mV and 880 mV to match platform power architectures.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • High-speed serial transceiver systems  Leverages family transceiver speed grades to implement high-bandwidth serial links and protocol bridging.
  • Memory-intensive digital processing  Large embedded RAM supports buffering and data-path storage for signal processing or custom compute engines.
  • Dense I/O interfacing  432 I/O pins provide the connectivity needed for multi-channel sensor, peripheral, or bus interfacing in complex systems.
  • Industrial control and automation  Industrial temperature rating and robust packaging support long-term operation in factory and process-control equipment.

Unique Advantages

  • Large programmable fabric: 490,000 logic elements enable implementation of extensive custom logic, hardware accelerators, and multi-function designs on a single device.
  • Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks, simplifying board-level design.
  • High I/O density: 432 I/O pins allow flexible interfacing to numerous peripherals and parallel buses without complex multiplexing.
  • Industrial-grade operation: Specified operation from −40 °C to 100 °C and industrial grading help ensure stable performance in demanding environments.
  • Compact, high-density package: 1152-FBGA (35×35) package provides a high pin-count solution in a space-efficient BGA form factor.
  • Environmentally compliant: RoHS-compliant construction supports regulatory and sustainability requirements.

Why Choose 5SGXMA5K3F35I3N?

This Stratix V GX device combines a very large logic resource pool, substantial embedded memory, and abundant I/O in an industrial-temperature-rated FPGA package. It is suited for engineering teams building complex, memory-rich, and I/O-heavy systems where on-chip resources and reliable operation across a wide temperature range are important design drivers.

Designed for customers requiring scalability and robustness, the 5SGXMA5K3F35I3N aligns with projects that need a high-capacity programmable fabric and high-density integration while maintaining industrial operating margins and RoHS compliance.

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