5SGXMA5K3F35I4WN

The 5SGXMA5K3F35I4WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-BBGA FCBGA package (35×35). It provides high logic density, abundant embedded RAM, and a large I/O count for designs that require substantial on-chip resources and flexible interfacing.

With industrial temperature grading and a defined core voltage range, this device is suited to applications that demand robust operation across extended temperature ranges and precise power delivery.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large-scale, complex digital designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for frame buffering, packet storage, and streaming data operations.
• I/O Resources  432 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  1152-BBGA, FCBGA supply package (listed as 1152-FBGA 35×35); surface-mount device for high-density PCB integration.
• Power Supply  Core voltage supply range: 820 mV to 880 mV, enabling precise core power budgeting in system design.
• Temperature & Grade  Industrial grade with operating temperature range of –40 °C to 100 °C for applications requiring extended thermal tolerance.
• Standards Compliance  RoHS compliant.
• Stratix V Family Documentation  Part of the Stratix V GX device family; series documentation describes device electrical characteristics, operating conditions, and transceiver options for system-level planning.

Typical Applications

• High‑density digital processing  Use the large logic and memory resources to implement complex signal processing, packet processing, or compute-acceleration functions.
• High‑pin-count systems  Large I/O complement supports boards requiring extensive parallel interfaces, bus bridging, or multi‑port connectivity.
• Transceiver‑enabled designs  As a Stratix V GX device, it aligns with system designs that exploit the family’s transceiver capabilities for high-rate serial links and protocol bridging (refer to family documentation for transceiver grade details).

Unique Advantages

• High on‑chip resource density: The combination of ~490,000 logic elements and ~46.08 Mbits of embedded RAM reduces the need for external memory and offloads system-level buffering.
• Ample I/O for system integration: 432 I/Os allow direct interfacing to a wide range of peripherals and parallel buses, simplifying board-level connectivity.
• Industrial temperature range: Rated from –40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact, surface-mount BBGA package: 1152-ball FCBGA (35×35) enables high-density PCB layouts while maintaining a standardized package footprint.
• Predictable core power requirement: Defined core supply range (820 mV–880 mV) supports precise power-supply design and thermal planning.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assembly processes.

Why Choose 5SGXMA5K3F35I4WN?

This Stratix V GX device delivers a balance of large logic capacity, significant embedded memory, and extensive I/O in a single industrial‑grade FCBGA package. It is well suited to designs that demand on‑chip resources and robust thermal performance while maintaining a compact board footprint.

Engineers designing high-density digital systems, multi‑interface boards, or transceiver-enabled links can leverage the documented Stratix V family characteristics alongside this part’s specific resource set to scale and validate system architectures with confidence.

Request a quote or submit an RFQ to begin procurement of the 5SGXMA5K3F35I4WN for your next design.