5SGXMA5K3F40C2LN

The 5SGXMA5K3F40C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. This commercial-grade FPGA delivers large programmable logic capacity, substantial on-chip memory, and a high pin count for complex digital designs.

With 490,000 logic elements, approximately 46 Mbits of embedded RAM, and 696 user I/Os, the device is targeted at designs requiring dense logic integration and extensive I/O connectivity while operating within standard commercial temperature conditions.

Key Features

• Core Logic Capacity — 490,000 logic elements (cells) to implement large-scale programmable logic and complex digital functions.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Density — 696 general-purpose I/Os to support high-pin-count interfaces and reduce external glue logic.
• Power — Core supply voltage range from 820 mV to 880 mV for the FPGA core.
• Package & Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA 40×40) with surface-mount mounting for compact board layout.
• Operating Grade & Temperature — Commercial grade, specified for operation from 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large programmable logic blocks and complex processing pipelines using the device's extensive logic element count and on-chip RAM.
• I/O-heavy platforms — Support designs that require many external connections or parallel interfaces by leveraging 696 user I/Os.
• FPGA-based prototyping and system integration — Use the device for consolidation of logic, memory, and I/O in prototype and production system designs within commercial temperature environments.

Unique Advantages

• High logic density: 490,000 logic elements enable integration of large, complex designs on a single device.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces reliance on external memory for many applications.
• Large I/O count: 696 I/Os simplify board-level connectivity and minimize the need for additional I/O expanders.
• Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) provides a high-pin-count solution in a surface-mount form factor.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliant: Facilitates environmental compliance for commercial product builds.
• Low-voltage core: 0.82–0.88 V core supply supports power-aware designs.

Why Choose 5SGXMA5K3F40C2LN?

The 5SGXMA5K3F40C2LN combines a very large logic element count with significant embedded RAM and a high I/O complement in a compact surface-mount FCBGA package. It is positioned for commercial designs that require dense programmable logic, on-chip memory, and broad connectivity within the 0 °C to 85 °C operating range.

This device is suited to engineers and teams consolidating complex digital functions into a single FPGA, providing scalability and integration while aligning with RoHS requirements and low-voltage core supply constraints.

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