5SGXMA5K3F40C2WN

The 5SGXMA5K3F40C2WN is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density, I/O-rich digital designs. Based on the Stratix V GX family architecture, this device combines a large logic fabric with substantial embedded RAM and a high count of user I/O to address complex system integration needs.

Intended for commercial-grade applications, the device provides a balance of logic capacity, memory resources, and peripheral connectivity for designs that require extensive on-chip processing and interfacing while operating within standard commercial temperature and voltage ranges.

Key Features

• High Logic Density – 490,000 logic elements for implementing large-scale logic, control and datapath functions.
• Embedded Memory – Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and data processing close to logic.
• Extensive I/O – 696 user I/O pins to accommodate wide parallel interfaces, board-level peripherals, and multi-protocol connectivity.
• Core Voltage – Operates from 870 mV to 930 mV, enabling integration with systems designed around low-voltage core rails.
• Package & Mounting – 1517-BBGA (FCBGA) package with supplier device package 1517-FBGA (40×40); surface-mount mounting for standard PCB assembly flows.
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operation for deployment in commercial-environment electronics.
• Compliance – RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• I/O-Intensive Systems – Use the high I/O count to implement wide data buses, parallel interfaces, and protocol bridging without external multiplexing.
• High-Density Logic Implementations – Large logic capacity enables complex state machines, control logic, and custom datapath acceleration within a single device.
• On-Chip Memory-Dependent Designs – Approximately 46 Mbits of embedded RAM supports buffering, FIFOs, and local data storage for real-time processing tasks.

Unique Advantages

• Consolidated Functionality: High logic element count and substantial embedded memory reduce the need for multiple discrete components, simplifying BOM and board layout.
• Broad Connectivity: 696 user I/Os provide flexibility for connecting sensors, peripherals, and high-pin-count interfaces directly to the FPGA.
• Commercial Deployment Ready: Designed for 0 °C to 85 °C operation and RoHS compliance to meet common commercial product requirements.
• Compact, Surface-Mount Package: 1517-BBGA FCBGA package supports high-density PCB designs while maintaining manufacturability with standard surface-mount processes.
• Low-Voltage Core Operation: Core voltage range of 870 mV–930 mV supports integration with modern low-voltage power architectures.

Why Choose 5SGXMA5K3F40C2WN?

The 5SGXMA5K3F40C2WN delivers a strong combination of logic capacity, embedded memory, and extensive I/O in a commercial-grade Stratix V GX FPGA package. It is well suited for engineers designing compact, high-functionality systems that require significant on-chip resources and broad interface options while operating within commercial temperature and voltage envelopes.

For development teams and procurement, this device provides scalability and design consolidation potential—helping reduce external components and simplify board-level integration—backed by the Stratix V GX family documentation and device characteristics.

Request a quote or submit a product inquiry to obtain pricing, lead time, and availability for the 5SGXMA5K3F40C2WN FPGA.