5SGXMA5K3F40C2LG

The 5SGXMA5K3F40C2LG is a Stratix V GX field programmable gate array (FPGA) IC from Intel, delivered in a 1517-ball FCBGA package. It provides high logic capacity and substantial on-chip memory, along with a large I/O count and a low-voltage core supply for dense, high-pin-count programmable logic designs.

This commercial-grade device is suited for applications that require large programmable logic resources, significant embedded RAM, and high connectivity in a compact surface-mount package.

Key Features

• Core Logic Capacity — 185,000 CLBs (configurable logic blocks) and 490,000 logic elements provide extensive resources for complex logic implementation.
• Embedded Memory — Approximately 46.08 Mbits of total on-chip RAM to support buffering, FIFOs, and data-intensive logic functions.
• High I/O Count — Up to 696 general-purpose I/Os to support wide, high-density interfacing and multi-channel connectivity.
• Package and Mounting — 1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) with surface-mount mounting for compact board integration.
• Power and Voltage — Core supply voltage specified between 820 mV and 880 mV for the device core domain.
• Operating Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory — RoHS compliant for environmentally conscious designs.

Typical Applications

• High-density digital systems — Implement large-scale custom logic, state machines, and algorithmic datapaths using hundreds of thousands of logic elements.
• Memory-intensive designs — Use the approximately 46 Mbits of embedded RAM for buffering, packet queues, and on-chip data management.
• High-pin-count interfaces — Leverage up to 696 I/Os to connect multiple peripherals, sensors, or parallel interfaces on a single device.
• Compact, board-level integration — The 1517-BBGA surface-mount package enables dense placement in space-constrained systems.

Unique Advantages

• High logic density: 490,000 logic elements allow implementation of large, complex designs without partitioning across multiple devices.
• Substantial embedded RAM: Approximately 46 Mbits of on-chip memory reduces external memory dependency for many buffering and streaming use cases.
• Extensive I/O capability: 696 I/Os support broad connectivity requirements, reducing the need for additional interface components.
• Compact high-pin-count package: The 1517-BBGA (40×40) FCBGA package balances pin count and board area for high-density systems.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments and typical operating environments.
• Low-voltage core domain: Core supply specified at 820–880 mV to align with modern low-voltage power architectures.

Why Choose 5SGXMA5K3F40C2LG?

The 5SGXMA5K3F40C2LG positions itself as a high-capacity Stratix V GX FPGA for applications demanding extensive logic resources, substantial embedded memory, and a large number of I/Os in a compact surface-mount package. Its combination of 490,000 logic elements, ~46 Mbits of on-chip RAM, and up to 696 I/Os makes it suitable for designers building dense programmable logic solutions that require integrated memory and wide interfacing without increasing board count.

Backed by Intel's Stratix V device documentation and electrical specifications, this commercial-grade FPGA provides transparent, datasheet-driven parameters for design, power budgeting, and thermal planning.

Request a quote or contact the sales team to discuss availability, pricing, and how the 5SGXMA5K3F40C2LG can fit into your next design.