5SGXMA5K3F40C2G

The 5SGXMA5K3F40C2G is a Stratix® V GX family FPGA from Intel, offering a very high logic capacity with abundant on‑chip memory and extensive I/O resources. It is delivered in a 1517‑BBGA FCBGA surface‑mount package and is specified for commercial temperature operation.

This device is well suited to designs that require large programmable logic, substantial embedded RAM, and a high count of external I/O connections, while operating from a low core supply voltage in a commercial temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements (logic cells) for large, complex programmable designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM (46,080,000 bits) to support buffering, FIFOs, and local data storage.
• I/O Density  696 device I/Os to support multiple external interfaces and parallel system connections.
• Package & Mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), surface‑mount for compact board integration.
• Power  Core voltage supply range: 870 mV to 930 mV, enabling low‑voltage core operation.
• Temperature & Grade  Commercial grade; specified operating temperature range 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density programmable logic systems  For designs that require a very large number of logic elements to implement complex digital functions.
• On‑chip buffering and data staging  Leveraging approximately 46 Mbits of embedded RAM for high‑capacity buffering and local data storage.
• Multi‑interface aggregation  High I/O count enables consolidation of many peripheral and interface connections on a single device.
• FPGA‑based prototype and accelerator platforms  Provides the logic and memory resources needed for prototyping complex IP and hardware accelerators.

Unique Advantages

• Large programmable capacity: Approximately 490,000 logic elements allow implementation of extensive logic networks and deep pipelines without immediate partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks, simplifying board design.
• Extensive I/O availability: 696 I/Os support dense connectivity for multi‑lane interfaces, parallel buses, and diverse peripheral integration.
• Compact FCBGA packaging: 1517‑BBGA (40×40) FCBGA provides a high‑density, surface‑mount form factor for space‑constrained PCBs.
• Low core voltage operation: Narrow core supply range (0.870 V–0.930 V) supports low‑voltage power architectures.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA5K3F40C2G?

This Stratix® V GX device combines very large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package—making it a fit for complex programmable systems that demand on‑chip resources and dense external connectivity. The device’s commercial temperature rating and RoHS compliance align it with standard production electronics environments.

Designed and supported by Intel, the device is backed by detailed device documentation and electrical characteristics, enabling system designers to plan power, thermal, and I/O integration around defined specifications such as core supply voltage and operating temperature.

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