5SGXMA5K3F35I3WN

The 5SGXMA5K3F35I3WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides a high logic capacity device architecture with embedded RAM and a large I/O complement in a 1152‑BBGA FCBGA package.

Device documentation for the Stratix V family describes programmable I/O timing and transceiver specifications for GX devices; this device is part of that Stratix V GX class and is intended for designs requiring significant programmable logic, embedded memory and substantial I/O capability.

Key Features

• Logic Capacity — Approximately 490,000 logic elements enabling complex digital designs and high-density implementation of custom logic functions.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, packet processing and large-state machine implementations.
• I/O Density — 432 user I/O pins to support wide parallel interfaces and diverse peripheral connections.
• Package & Mounting — 1152‑BBGA (FCBGA) 35×35 supplier package, surface-mount mounting for compact board integration.
• Power — Core voltage supply range of 0.820 V to 0.880 V to match Stratix V power domains.
• Temperature Grade — Industrial operating temperature range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Standards & Compliance — RoHS compliant.
• Family-Level Features — As a Stratix V GX device, documented family features include programmable I/O element (IOE) delay, programmable output buffer delay and transceiver specifications as detailed in the Stratix V device datasheet.

Typical Applications

• High‑performance networking — Use where substantial logic and embedded memory are required alongside flexible I/O and transceiver-capable Stratix V GX family features.
• Signal processing and instrumentation — Implements complex algorithms and buffering with the large logic element count and approximately 46 Mbits of embedded RAM.
• Interface aggregation — High I/O count supports aggregating multiple parallel or serialized interfaces on a single device.

Unique Advantages

• High integration density: Approximately 490,000 logic elements reduce the need for multiple FPGAs in complex designs.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM supports large buffers, packet queues and state storage without external memory.
• Extensive I/O: 432 I/O pins enable broad peripheral connectivity and flexible board-level partitioning.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
• Compact, high‑density package: 1152‑BBGA FCBGA (35×35) package streamlines PCB area while delivering high pin count.
• Low-voltage core: 0.820–0.880 V supply aligns with Stratix V core power domains for efficient power management.

Why Choose 5SGXMA5K3F35I3WN?

The 5SGXMA5K3F35I3WN positions itself as a high‑capacity Stratix V GX FPGA option for applications that demand significant programmable logic, embedded memory and broad I/O in a single device. Its industrial temperature rating and RoHS compliance make it suitable for temperature-challenging, environmentally conscious designs.

Engineers can leverage the device’s documented Stratix V family features—programmable I/O timing and transceiver specifications—alongside extensive on‑chip resources to simplify system design, reduce external components and support scalable implementations backed by Intel’s Stratix V documentation.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA5K3F35I3WN.