5SGXMA5K3F35I3LN

The 5SGXMA5K3F35I3LN is a Stratix® V GX family field-programmable gate array provided in a high-density 1152-ball BGA package. It combines large logic capacity, substantial on-chip memory, and a high I/O count for complex, I/O‑intensive FPGA designs.

This device targets industrial-grade applications that require significant programmable logic resources, plentiful embedded memory, and a compact surface-mount FCBGA footprint while operating over a wide temperature and core-voltage range.

Key Features

• Logic Capacity  490,000 logic elements suitable for large-scale, highly parallel digital designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
• High I/O Count  432 user I/Os to support wide parallel interfaces and large external device connectivity.
• Power and Core Voltage  Core supply range of 820 mV to 880 mV to match Stratix V core-voltage requirements and system power rails.
• Package and Mounting  1152-BBGA / 1152-FBGA (35×35) FCBGA surface-mount package for high-density board integration.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant for environmentally regulated assemblies.

Typical Applications

• High-density digital designs  Use the large logic fabric and abundant I/Os to implement complex, parallel processing functions and custom accelerators.
• Embedded memory-heavy implementations  Leverage approximately 46 Mbits of on-chip RAM for packet buffering, frame storage, and intermediate data processing.
• Industrial control and automation  Industrial temperature rating and high I/O count support robust control systems and sensor/actuator interfaces.

Unique Advantages

• Substantial programmable capacity  490,000 logic elements provide headroom for large finite-state machines, datapaths, and custom logic cores.
• Significant on-chip memory  Approximately 46 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level designs.
• High I/O integration  432 I/Os enable wide parallel buses and flexible interface routing without immediate need for additional bridging devices.
• Industrial temperature support  Rated for −40 °C to 100 °C to meet many industrial deployment requirements.
• Compact BGA footprint  1152-ball FCBGA package (35×35) delivers high density for space-constrained PCBs while supporting surface-mount assembly.
• Compliance and manufacturability  RoHS compliance and standard surface-mount packaging simplify procurement and production planning.

Why Choose 5SGXMA5K3F35I3LN?

The 5SGXMA5K3F35I3LN positions itself for designs that demand large programmable logic, ample on-chip RAM, and extensive I/O in a single industrial-grade FPGA. Its combination of 490,000 logic elements, approximately 46 Mbits of embedded memory, and 432 user I/Os makes it suitable for complex digital systems and dense interface requirements while remaining compatible with standard surface-mount production.

For engineering teams focused on scalability and robust operation across a wide temperature range, this Stratix V GX device offers a balanced mix of capacity, integration, and packaging choices to streamline system design and long-term deployment.

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