5SGXMA5K3F35I3

The 5SGXMA5K3F35I3 is a Stratix V GX Field Programmable Gate Array (FPGA) device delivering high logic density and large on-chip memory for programmable system designs. Built for industrial temperature operation, the device integrates extensive I/O and memory resources in a 1152-ball FCBGA package to support complex, high-density digital designs.

Key technical attributes include 490,000 logic elements, approximately 46 Mbits of embedded memory, 432 user I/O pins, and a low-voltage core operating range from 0.820 V to 0.880 V—features that target industrial and commercial applications that require programmable, compact, and robust logic solutions.

Key Features

• Core Logic  490,000 logic elements provide substantial programmable logic fabric for large-scale designs and integration of complex functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM supports large buffering, state storage, and data-path implementations without external memory.
• I/O Count & Flexibility  432 user I/O pins enable extensive peripheral and interface connectivity directly from the device.
• Packaging  Supplied in a 1152-ball FBGA package (35 × 35 mm), suitable for compact, high-density board layouts with surface-mount assembly.
• Power Requirements  Core supply specified from 0.820 V to 0.880 V for precise power budgeting and system power-plane design.
• Operating Temperature  Rated for industrial operation from –40 °C to 100 °C to meet temperature demands in harsh environments.
• Regulatory Compliance & Mounting  RoHS compliant and designed for surface-mount assembly to support standard manufacturing processes.

Typical Applications

• Industrial Control  Use the device for programmable control, complex logic sequencing, and I/O-heavy automation tasks where industrial temperature range is required.
• Networking & Communications  High logic density and abundant I/O enable protocol processing, packet handling, and interface bridging in commercial networking equipment.
• High-Density System Integration  On-chip memory and extensive logic resources allow consolidation of multiple functions into a single FPGA for compact system designs.

Unique Advantages

• High Logic Capacity: 490,000 logic elements let designers implement large, integrated digital systems without partitioning across multiple devices.
• Substantial On-Chip RAM: Approximately 46 Mbits of embedded memory reduces dependency on external memory, simplifying BOM and board routing.
• Extensive I/O Count: 432 I/Os provide flexibility for diverse peripheral interfaces and high pin-count connectivity within a single package.
• Industrial Temperature Rating: –40 °C to 100 °C operation supports deployment in demanding environmental conditions common in industrial applications.
• Compact, High-Density Package: The 1152-FBGA (35 × 35 mm) package enables dense board integration while maintaining a surface-mount form factor.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and regulatory alignment.

Why Choose 5SGXMA5K3F35I3?

The 5SGXMA5K3F35I3 Stratix V GX FPGA is positioned for designs requiring a combination of high logic capacity, substantial embedded memory, and broad I/O in an industrial-rated package. Its specification set supports consolidation of complex functions into a single programmable device, enabling designers to reduce board-level complexity and streamline system integration.

For engineering teams targeting robust industrial and commercial applications that need scalable programmable logic with verified operating and power parameters, this device offers a verifiable platform backed by Stratix V family documentation and device-level electrical characteristics.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA5K3F35I3 Stratix V GX FPGA.