5SGXMA5K3F35C3WN

The 5SGXMA5K3F35C3WN is a Stratix® V GX field programmable gate array (FPGA) optimized for commercial-grade applications that require high programmable logic density and substantial on-chip memory. This device integrates a large array of logic resources, significant embedded RAM, and a broad I/O count in a 1152‑ball FCBGA package to support complex digital designs.

Designed for projects that demand dense logic, abundant embedded memory, and a high number of I/O signals within a commercial temperature envelope, this Stratix V GX device provides a platform for advanced system-level integration and flexible hardware acceleration.

Key Features

• Core Logic Capacity  Approximately 490,000 logic elements for large-scale digital designs and complex RTL implementations.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage for high-throughput tasks.
• I/O Count  432 I/O pins to interface with dense peripheral sets, transceiver front ends, and multi-channel systems.
• Package & Mounting  1152‑BBGA FCBGA package (supplier package listed as 1152‑FBGA (35×35)) with surface‑mount mounting for compact board implementations.
• Power  Specified core voltage supply range of 820 mV to 880 mV to match system power budgeting and regulator design.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial deployments.
• Regulatory Status  RoHS compliant.

Typical Applications

• High‑density digital processing  Leverage the large logic element count and embedded RAM for signal processing, algorithm acceleration, and custom compute engines.
• Networking and communications  Use the abundant I/Os and Stratix V GX architecture to implement packet processing, protocol bridging, and I/O‑intensive interfaces.
• System prototyping and hardware acceleration  Deploy as a high-capacity programmable fabric for prototyping ASIC functions or accelerating compute tasks in commercial systems.

Unique Advantages

• High programmable density: The large pool of logic elements enables implementation of complex designs without immediate migration to larger devices.
• Substantial on‑chip RAM: Approximately 46.08 Mbits of embedded memory reduces external memory dependence for many buffering and data‑path needs.
• Generous I/O resources: 432 I/Os simplify routing to multiple peripherals and parallel interfaces, minimizing external glue logic.
• Compact, surface‑mount packaging: The 1152‑ball FCBGA package provides a high pin‑count solution in a single package for dense board designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial deployments and applications.
• RoHS compliant: Meets common environmental compliance requirements for commercial electronics manufacturing.

Why Choose 5SGXMA5K3F35C3WN?

The 5SGXMA5K3F35C3WN delivers a balance of high logic density, significant on‑chip RAM, and a large I/O complement in a commercial‑grade Stratix V GX FPGA package. Its electrical and packaging specifications make it suitable for engineers developing complex, I/O‑rich systems that require flexible hardware acceleration and extensive programmable resources.

This device is well suited to design teams and procurement groups targeting scalable FPGA-based solutions where on‑chip memory, logic capacity, and I/O count directly impact system partitioning, performance, and BOM simplification.

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