5SGXMA5K3F35C4G

The 5SGXMA5K3F35C4G is a Stratix V GX family field programmable gate array (FPGA) offered in a 1152‑ball FCBGA package. It provides high logic density with approximately 490,000 logic elements and about 46.08 Mbits of embedded memory, together with 432 user I/Os for complex, high‑pin‑count designs.

Electrical and environmental characteristics include a core supply range of 820 mV to 880 mV and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and intended for surface‑mount board assembly.

Key Features

• Logic Capacity — Approximately 490,000 logic elements to implement large programmable logic and control functions.
• Embedded Memory — Approximately 46.08 Mbits of on‑chip RAM for data buffering, state storage, and memory‑intensive logic.
• I/O Resources — 432 user I/O pins to support wide parallel buses, multiple interfaces, and complex board-level connectivity.
• Power and Core Voltage — Core supply voltage range of 820 mV to 880 mV, allowing designers to target specified core power and performance points.
• Package and Mounting — 1152‑FBGA (35 × 35 mm) FCBGA package, surface‑mount compatible for high‑density PCB designs.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Standards Compliance — RoHS compliant for reduced hazardous substance content.

Typical Applications

• High‑density programmable logic — Large logic capacity and abundant embedded memory support complex state machines, protocol processing, and custom compute blocks.
• High‑pin‑count interface aggregation — 432 I/Os enable consolidation of multiple parallel interfaces and board‑level connectivity tasks.
• FPGA‑based system integration — Use as the programmable heart of systems requiring configurable logic, on‑chip memory, and dense I/O in a compact FCBGA package.

Unique Advantages

• High logic density: Approximately 490,000 logic elements provide capacity to implement large, complex designs on a single device, reducing the need for multiple FPGAs.
• Substantial embedded memory: About 46.08 Mbits of on‑chip RAM supports buffering, queuing, and memory‑intensive algorithms without heavy external memory dependence.
• Large I/O count: 432 user I/Os give designers flexibility to handle multiple interfaces and wide data paths directly at the FPGA I/O boundary.
• Compact, manufacturable package: 1152‑FBGA (35 × 35 mm) FCBGA surface‑mount package balances a high ball count with a footprint suitable for dense PCB layouts.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant, fitting standard commercial product requirements and environmental regulations.
• Controlled core voltage range: 820 mV–880 mV core supply range enables deterministic power planning for system design.

Why Choose 5SGXMA5K3F35C4G?

The 5SGXMA5K3F35C4G delivers a combination of high logic density, substantial on‑chip memory, and a large I/O footprint in a compact FCBGA package. These characteristics make it suitable for designers who need to integrate substantial programmable logic and memory on a single device while maintaining flexible board‑level connectivity.

With defined electrical parameters and commercial temperature grading, this FPGA is positioned for complex system designs where predictable power planning, high logic capacity, and dense I/O are priority selection criteria.

Request a quote or submit a product inquiry to obtain pricing, availability, and support for integrating the 5SGXMA5K3F35C4G into your next design.