5SGXMA5K3F35C3G

The 5SGXMA5K3F35C3G is an Intel Stratix® V GX field programmable gate array (FPGA) device delivering very high logic density and on-chip memory for demanding commercial applications. The device integrates approximately 490,000 logic elements and approximately 46 Mbits of embedded RAM, alongside 432 user I/Os, all in a high-density 1152-BBGA (35×35 mm) FCBGA package.

Designed for surface-mount assembly and rated for commercial temperature operation (0 °C to 85 °C), this Stratix V GX FPGA targets designs that require large programmable logic capacity, substantial embedded memory, and dense I/O in a compact package footprint. The device operates with a core voltage supply in the range of 820 mV to 880 mV and is RoHS compliant.

Key Features

• Core Logic  Approximately 490,000 logic elements provide large-scale programmable logic capacity for complex custom logic and algorithm implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support data buffering, packet storage, and memory-intensive processing within the FPGA fabric.
• I/O Density  432 user I/Os for high-density board-level interfacing and flexible connectivity options to external peripherals and subsystems.
• Package & Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor to support compact, high-pin-count designs.
• Power  Core voltage supply specified from 820 mV to 880 mV to match system power-rail design constraints for Stratix V devices.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Compliance  RoHS compliant to meet common lead-free assembly and environmental requirements.

Typical Applications

• High-density logic and prototyping  Large logic capacity and abundant embedded RAM enable complex prototype designs and rapid architectural evaluation without external logic expansion.
• Data processing and acceleration  On-chip memory and plentiful logic elements support custom data-path acceleration and packet processing tasks within commercial systems.
• Dense I/O systems  432 I/Os provide the connectivity needed for multi-interface boards, bridges, or front-end protocol adaptation in commercial equipment.

Unique Advantages

• High programmable capacity:  Approximately 490,000 logic elements allow integration of complex state machines, datapaths, and control logic into a single device, reducing board-level component count.
• Substantial on-chip memory:  Around 46 Mbits of embedded RAM reduces dependence on off-chip memory for buffering and accelerates data-intensive workloads.
• Compact, high-pin-count package:  1152-BBGA (35×35) packaging delivers a high I/O count in a compact footprint for space-constrained commercial designs.
• Commercial-temperature grading:  Rated for 0 °C to 85 °C to match typical commercial operating environments and deployment scenarios.
• Low-voltage core support:  Core supply range of 820–880 mV aligns with low-voltage power architectures used in modern high-performance FPGA systems.
• RoHS compliance:  Meets lead-free assembly requirements for mainstream commercial manufacturing.

Why Choose 5SGXMA5K3F35C3G?

The 5SGXMA5K3F35C3G delivers a combination of very large logic capacity, significant embedded memory, and dense I/O in a single Stratix V GX device optimized for commercial applications. Its package and electrical characteristics make it suitable for compact, high-performance designs that need substantial programmable resources without relying on multiple discrete ICs.

Engineers and procurement teams seeking scalability, robust on-chip resources, and a Stratix V family solution for commercial product lines will find this device aligns with demanding logic, memory, and I/O requirements while supporting standard commercial temperature operation and RoHS-compliant manufacturing.

Request a quote or submit a procurement inquiry to evaluate 5SGXMA5K3F35C3G for your design and get pricing and availability information tailored to your project needs.