5SGXMA5K3F35C2LG

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 1,505 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F35C2LG – Stratix V GX FPGA, approximately 490,000 logic elements, 1152‑BBGA

The 5SGXMA5K3F35C2LG is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. It delivers high logic density and significant on-chip memory in a 1152‑ball FBGA package, with a large number of I/O pins and a defined core voltage range.

This device is provided for commercial-grade applications that require substantial programmable logic capacity, abundant embedded memory, and a high I/O count in a surface-mount 1152‑BBGA (35 × 35) form factor.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements suitable for large-scale programmable logic designs.
  • Embedded Memory  Approximately 46 Mbits of total on-chip RAM for buffering, state storage, and embedded data handling.
  • I/O Density  432 I/O pins to support numerous external interfaces and high channel counts.
  • Package  1152‑BBGA, FCBGA package; supplier package listed as 1152‑FBGA (35×35) for surface-mount board integration.
  • Power Supply  Specified operating voltage range of 820 mV to 880 mV.
  • Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C.
  • Mounting  Surface-mount device for standard PCB assembly processes.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density programmable logic systems  Use where large logic capacity and substantial embedded memory are required for custom digital processing.
  • High I/O interface platforms  Deploy in designs that need hundreds of external I/O connections to support multi-channel or multi-interface systems.
  • Commercial embedded systems  Suitable for commercial-temperature applications operating within 0 °C to 85 °C that benefit from a high-density FPGA.

Unique Advantages

  • Large logic fabric  Approximately 490,000 logic elements provide the capacity to implement complex custom logic and large IP cores.
  • Substantial on-chip RAM  Approximately 46 Mbits of embedded memory allows local buffering and stateful processing without immediate external memory dependence.
  • High I/O count  432 I/Os enable extensive external connectivity for multi-channel or multi-protocol designs.
  • Compact surface-mount package  1152‑BBGA (35×35) offers a dense package option for space-constrained PCBs while maintaining high pin count.
  • Commercial-grade specification  Rated for 0 °C to 85 °C operation and RoHS compliance for commercial product lifecycles.

Why Choose 5SGXMA5K3F35C2LG?

The 5SGXMA5K3F35C2LG positions itself as a high-density Stratix V GX FPGA for commercial applications that demand a large programmable fabric, significant embedded memory, and numerous I/Os in a single surface-mount package. Its defined voltage range and commercial temperature rating make it suitable for production designs within those operating envelopes.

As an Intel Stratix V GX device, it is supported by published device documentation that details electrical and switching characteristics for integration and qualification during development and manufacturing.

Request a quote or submit a sales inquiry to get pricing, availability, and ordering information for the 5SGXMA5K3F35C2LG.

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