5SGXMA5K2F40I3N

The 5SGXMA5K2F40I3N is a Stratix V GX family FPGA in a 1517-ball FCBGA package. It delivers very large programmable logic capacity along with substantial on-chip embedded memory and a high I/O count for dense, complex digital designs.

Targeted for industrial-grade applications, this device combines approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 696 I/O pins in a surface-mount 1517-BBGA (40×40) footprint. The device operates from a core supply between 820 mV and 880 mV and is rated for operation from –40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large-scale digital systems and consolidate multiple functions on a single device.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffers, packet queues, or algorithmic state storage without immediate need for external memory.
• High I/O Count  696 user I/O pins for dense board-level interfacing and parallel connectivity to peripherals, memory, or custom I/O fabrics.
• Industrial Temperature Grade  Specified operating range of –40 °C to 100 °C suitable for extended-temperature industrial applications.
• Power  Core supply range of 820 mV to 880 mV to match low-voltage system architectures and power-optimization strategies.
• Package & Mounting  1517-BBGA (FCBGA) surface-mount package, supplier device package 1517-FBGA (40×40), enabling compact board designs.
• Standards Compliance  RoHS compliant for regulatory environmental requirements.
• Documentation  Part of the Stratix V family with a device datasheet describing electrical and switching characteristics for design and integration.

Typical Applications

• High-density digital processing  Implement large combinational and sequential logic, control functions, and custom accelerators using the device's high logic capacity.
• Data buffering and on-chip storage  Use the substantial embedded RAM to handle packet buffering, FIFOs, and intermediate data storage without excessive external memory.
• Dense I/O systems  Integrate with large sensor arrays, parallel interfaces, or complex peripheral fabrics that require hundreds of I/O signals.

Unique Advantages

• High integration density: Consolidate multiple functions on a single FPGA with approximately 490,000 logic elements, reducing board-level complexity.
• Large embedded memory footprint: Approximately 46 Mbits of on-chip RAM lowers dependence on external memory and simplifies timing/resource allocation.
• Extensive I/O capability: 696 I/Os enable flexible interfacing options for complex systems and high connector densities.
• Industrial-grade operation: Rated from –40 °C to 100 °C for deployments in extended-temperature environments.
• Compact FCBGA package: 1517-ball FCBGA (40×40) supports compact, surface-mount implementations while providing high pin-count access.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose 5SGXMA5K2F40I3N?

The 5SGXMA5K2F40I3N delivers a balanced combination of very large logic capacity, significant on-chip RAM, and a high I/O count in a compact FCBGA package for industrial-temperature applications. It is well suited for designers who need to consolidate complex digital functions, large buffer memory, and dense board-level interfaces into a single FPGA solution.

As a member of the Stratix V GX family, this device is documented within the Stratix V device datasheet set for electrical and switching characteristics, providing the technical data needed for system integration and power/thermal planning.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA5K2F40I3N and to begin planning your design-in process.