5SGXMA5K3F40C4WN

The 5SGXMA5K3F40C4WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC providing large, on-chip programmable logic and memory resources for advanced digital designs. As a Stratix V GX device, it targets designs that require extensive logic element counts, abundant embedded RAM, and a high I/O count for board-level integration.

With 490,000 logic elements, approximately 46 Mbits of embedded memory and 696 user I/O, this device is positioned for complex system implementations where dense programmable logic and wide connectivity are required. The device is supplied in a 1517-ball FBGA package and is offered as a commercial-grade part.

Key Features

• Core Capacity — 490,000 logic elements and 185,000 LABs provide a high-density programmable fabric for implementing extensive logic and custom datapaths.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O and Connectivity — 696 user I/O pins to accommodate wide parallel interfaces and complex board-level routing requirements.
• Transceiver Capabilities (series-level) — Stratix V GX devices support transceiver speed grades shown in the series datasheet, including GX channel options up to 14.1 Gbps (series-level specification).
• Power and Supply — Core supply range specified at 820 mV to 880 mV for core voltage planning and power budgeting.
• Package & Mounting — 1517-BBGA (FCBGA) supplier device package, 1517-FBGA (40×40) form factor; surface-mount device suitable for board assembly.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory planning.

Typical Applications

• High-bandwidth networking — Leverage 696 I/O and the Stratix V GX transceiver speed grades to implement multi‑lane interfaces and packet-processing pipelines.
• Digital signal processing — Large logic capacity and ~46 Mbits of embedded RAM enable complex DSP algorithms, pipelines, and buffering on-chip.
• Custom compute acceleration — Use the device’s dense logic and memory resources to implement application-specific accelerators and hardware offloads.
• Board-level integration — 1517-ball FBGA package and surface-mount mounting support compact, high-density PCB implementations.

Unique Advantages

• High-capacity programmable fabric: 490,000 logic elements and 185,000 LABs allow large designs to be implemented on a single device, reducing cross-chip latency and system complexity.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces external RAM dependence and simplifies memory architecture for buffering and state retention.
• Extensive I/O count: 696 user I/O pins enable broad interface support and flexible board-level connectivity without external multiplexing.
• Commercial-grade thermal range: Specified 0 °C to 85 °C operation for mainstream commercial deployments and design planning.
• Package options for dense boards: 1517-ball FBGA (40×40) surface-mount package supports compact board layouts and high-pin-count routing.
• Regulatory readiness: RoHS compliance simplifies environmental handling and regulatory considerations.

Why Choose 5SGXMA5K3F40C4WN?

The 5SGXMA5K3F40C4WN delivers a combination of high logic capacity, generous embedded memory, and a large I/O complement in a compact BGA package, making it well suited for designs that require dense programmable logic and broad board connectivity. As a Stratix V GX device, it aligns with the series-level transceiver and performance characteristics documented in the Stratix V device datasheet.

This part is appropriate for engineering teams implementing complex digital signal processing, networking interfaces, or custom accelerators where on-chip resources reduce system BOM and simplify board-level architecture. Its commercial-grade rating and RoHS compliance support mainstream product development and deployment.

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