5SGXMA5K3F40I3LG

The 5SGXMA5K3F40I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, provided in a 1517-ball FCBGA package. It delivers high logic density, substantial embedded RAM, and extensive I/O for complex, programmable digital designs.

Designed for applications that require large on-chip resources and robust thermal range, this industrial-grade device combines approximately 490,000 logic elements, ~46.08 Mbits of embedded memory, and 696 user I/O in a surface-mount BGA package.

Key Features

• Core Logic — Approximately 490,000 logic elements to implement large-scale programmable logic and custom hardware acceleration.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, FIFOs, and large local data structures without external memory.
• I/O Capacity — 696 user I/O pins for broad interfacing to peripherals, serializers, and parallel buses.
• Package & Mounting — 1517-BBGA (1517-FBGA, 40×40) surface-mount package optimized for high-density PCB layouts.
• Power — Core voltage supply range specified at 0.820 V to 0.880 V for the device core domain.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding ambient conditions.
• Compliance — RoHS compliant.

Typical Applications

• High-density signal processing — Use the large logic capacity and embedded memory for real-time packet processing, filtering, and algorithm acceleration.
• Multi-channel I/O aggregation — 696 I/O pins enable consolidation of many parallel and serial interfaces on a single device.
• Industrial systems — Industrial temperature rating and robust package make it suitable for factory automation, test equipment, and instrumentation.
• Transceiver-enabled designs — As a GX device in the Stratix V family, it supports designs that incorporate high-performance serial/transceiver subsystems.

Unique Advantages

• High logic capacity: Approximately 490,000 logic elements reduce the need for multi-device partitioning and simplify system architecture.
• Large on-chip RAM: ~46.08 Mbits of embedded memory supports deep buffering and complex state machines without external memory overhead.
• Extensive I/O integration: 696 I/O pins provide flexibility for mixed-signal front ends, large bus interfaces, and dense connector layouts.
• Industrial operating range: −40 °C to 100 °C supports deployment in harsher environments and extended-temperature applications.
• Compact BGA package: 1517-FBGA (40×40) delivers high pin count in a space-efficient footprint for PCB real estate savings.
• Low-voltage core: 0.820–0.880 V core supply helps manage core power domains in multi-voltage system designs.

Why Choose 5SGXMA5K3F40I3LG?

This Stratix V GX device balances large programmable logic capacity, substantial embedded memory, and broad I/O in a single industrial-grade BGA package. It is well suited to engineers building complex, high-density FPGA designs that demand on-chip resources and robust thermal performance.

As part of the Stratix V family from Intel, the device aligns with established device documentation and support for design integration, making it a practical choice for teams targeting scalable, high-performance programmable solutions.

Request a quote or submit an availability inquiry to evaluate 5SGXMA5K3F40I3LG for your next high-density FPGA design.