5SGXMA5K3F40I3WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

Quantity 485 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F40I3WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

The 5SGXMA5K3F40I3WN is a Stratix V GX family FPGA optimized for designs that require very high logic density, substantial embedded memory, and extensive I/O. This industrial-grade, surface-mount FPGA provides a combination of 490,000 logic elements and approximately 46.08 Mbits of on-chip RAM to support complex custom digital processing and control functions.

Designed for applications that demand dense integration and robust thermal range, the device supports a low-voltage core supply and a high pin-count FBGA package for compact, high-performance board designs.

Key Features

  • High Logic Density  Approximately 490,000 logic elements to implement large-scale custom logic, state machines, and parallel processing pipelines.
  • On-chip Memory  Approximately 46.08 Mbits of embedded memory to store buffers, lookup tables, and intermediate data without external memory requirements.
  • Extensive I/O  696 user I/O pins to support a wide range of parallel and serial interfaces and complex board-level connectivity.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
  • Low-Voltage Core  Core supply range of 820 mV to 880 mV to match system power-rail planning and optimize power delivery for the device core.
  • High-Density Package  1517-ball FCBGA (1517-FBGA, 40×40) package for compact board layouts with a high pin count; surface-mount compatible.
  • Series-Level Electrical and Switching Characterization  As part of the Stratix V GX family, device behavior and performance are documented with detailed electrical and switching characteristics including I/O timing and transceiver specifications in the Stratix V device datasheet.

Typical Applications

  • High-density digital processing  Implement complex signal processing, packet processing, or algorithm acceleration using the device's large logic array and embedded RAM.
  • I/O-intensive systems  Deploy in applications that require extensive external connectivity or multiple parallel interfaces leveraging 696 I/O pins.
  • Industrial embedded systems  Use in industrial control, instrumentation, and automation designs that benefit from the device’s industrial temperature rating (–40 °C to 100 °C).
  • Compact, high-pin-count boards  Ideal for systems constrained by PCB area that need a high-ball-count FBGA package to maximize functionality in a compact footprint.

Unique Advantages

  • Highly integrated logic and memory: Combine roughly 490,000 logic elements with ~46.08 Mbits of on-chip RAM to minimize external component count and simplify board design.
  • Large I/O capacity: 696 I/O pins enable flexible interfacing for multi-channel data paths, sensor arrays, or extensive peripheral connectivity.
  • Industrial ready: Specified for –40 °C to 100 °C operation, supporting deployment in demanding thermal environments.
  • Compact package for complex designs: 1517-ball FCBGA (40×40) offers high pin density while maintaining a surface-mount footprint for modern PCBs.
  • Controlled core voltage range: 820–880 mV core supply allows predictable power partitioning and integration with system power architectures.

Why Choose 5SGXMA5K3F40I3WN?

The 5SGXMA5K3F40I3WN positions itself where high logic density, substantial on-chip memory, and extensive I/O converge in a single industrial-grade FPGA package. Its combination of approximately 490,000 logic elements, ~46.08 Mbits of embedded RAM, and 696 I/O pins makes it suitable for complex digital systems and compact, high-functionality boards.

Engineers and procurement teams seeking a robust, high-capacity FPGA for industrial applications will find this Stratix V GX device offers a balanced mix of integration, thermal range, and package density, backed by the Stratix V family electrical and switching characterization.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA5K3F40I3WN and to discuss how it fits your next high-density FPGA design.

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