5SGXMA5K3F40I3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 485 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K3F40I3WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA
The 5SGXMA5K3F40I3WN is a Stratix V GX family FPGA optimized for designs that require very high logic density, substantial embedded memory, and extensive I/O. This industrial-grade, surface-mount FPGA provides a combination of 490,000 logic elements and approximately 46.08 Mbits of on-chip RAM to support complex custom digital processing and control functions.
Designed for applications that demand dense integration and robust thermal range, the device supports a low-voltage core supply and a high pin-count FBGA package for compact, high-performance board designs.
Key Features
- High Logic Density Approximately 490,000 logic elements to implement large-scale custom logic, state machines, and parallel processing pipelines.
- On-chip Memory Approximately 46.08 Mbits of embedded memory to store buffers, lookup tables, and intermediate data without external memory requirements.
- Extensive I/O 696 user I/O pins to support a wide range of parallel and serial interfaces and complex board-level connectivity.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
- Low-Voltage Core Core supply range of 820 mV to 880 mV to match system power-rail planning and optimize power delivery for the device core.
- High-Density Package 1517-ball FCBGA (1517-FBGA, 40×40) package for compact board layouts with a high pin count; surface-mount compatible.
- Series-Level Electrical and Switching Characterization As part of the Stratix V GX family, device behavior and performance are documented with detailed electrical and switching characteristics including I/O timing and transceiver specifications in the Stratix V device datasheet.
Typical Applications
- High-density digital processing Implement complex signal processing, packet processing, or algorithm acceleration using the device's large logic array and embedded RAM.
- I/O-intensive systems Deploy in applications that require extensive external connectivity or multiple parallel interfaces leveraging 696 I/O pins.
- Industrial embedded systems Use in industrial control, instrumentation, and automation designs that benefit from the device’s industrial temperature rating (–40 °C to 100 °C).
- Compact, high-pin-count boards Ideal for systems constrained by PCB area that need a high-ball-count FBGA package to maximize functionality in a compact footprint.
Unique Advantages
- Highly integrated logic and memory: Combine roughly 490,000 logic elements with ~46.08 Mbits of on-chip RAM to minimize external component count and simplify board design.
- Large I/O capacity: 696 I/O pins enable flexible interfacing for multi-channel data paths, sensor arrays, or extensive peripheral connectivity.
- Industrial ready: Specified for –40 °C to 100 °C operation, supporting deployment in demanding thermal environments.
- Compact package for complex designs: 1517-ball FCBGA (40×40) offers high pin density while maintaining a surface-mount footprint for modern PCBs.
- Controlled core voltage range: 820–880 mV core supply allows predictable power partitioning and integration with system power architectures.
Why Choose 5SGXMA5K3F40I3WN?
The 5SGXMA5K3F40I3WN positions itself where high logic density, substantial on-chip memory, and extensive I/O converge in a single industrial-grade FPGA package. Its combination of approximately 490,000 logic elements, ~46.08 Mbits of embedded RAM, and 696 I/O pins makes it suitable for complex digital systems and compact, high-functionality boards.
Engineers and procurement teams seeking a robust, high-capacity FPGA for industrial applications will find this Stratix V GX device offers a balanced mix of integration, thermal range, and package density, backed by the Stratix V family electrical and switching characterization.
Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA5K3F40I3WN and to discuss how it fits your next high-density FPGA design.

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