5SGXMA5K3F40I3NCV

The 5SGXMA5K3F40I3NCV is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1517‑BBGA FCBGA package, designed for industrial-temperature applications. It delivers a combination of high logic density, on-chip memory, and a large I/O complement to support complex digital designs and system integration.

This device targets designs that require substantial programmable logic and embedded memory while operating across an industrial temperature range. Its package and electrical characteristics make it suitable for densely integrated board-level implementations that demand robust thermal and electrical performance.

Key Features

• High Logic Capacity — 490,000 logic elements to implement complex state machines, datapaths, and custom silicon-accelerated functions.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, LUT-based storage, and high-throughput data processing.
• Large I/O Count — 696 user I/O pins, enabling extensive peripheral interfacing, multi-lane connectivity, and wide parallel buses.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in temperature-demanding environments.
• Core Voltage Range — 820 mV to 880 mV supply range for the device core, compatible with controlled-power architectures.
• Package & Mounting — 1517‑BBGA (FCBGA) supplier package (1517‑FBGA, 40×40) in a surface-mount form factor for high-density PCB layouts.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing and assembly.

Typical Applications

• High-density signal processing: Large logic capacity and substantial on-chip RAM enable complex DSP pipelines, packet processing, and real-time data manipulation.
• Network and connectivity systems: High I/O count supports multi-lane interfaces and extensive peripheral aggregation for networking and telecom equipment.
• Industrial control and automation: Industrial temperature rating and robust packaging make the device suitable for controllers and data acquisition systems used in harsh environments.
• System integration and prototyping: Surface-mount FCBGA package and broad I/O availability support dense board-level integration and system-level validation.

Unique Advantages

• Substantial programmable logic: 490,000 logic elements simplify migration of complex algorithms and hardware accelerators into a single FPGA fabric, reducing system BOM.
• Large embedded memory footprint: Approximately 46 Mbits of on-chip RAM reduces external memory dependencies for many buffering and state-storage needs.
• Extensive I/O flexibility: 696 I/O pins allow broad interfacing options and parallel connectivity, minimizing the need for external I/O expanders.
• Industrial-grade operation: –40 °C to 100 °C temperature rating supports deployment in temperature-challenging installations without additional thermal derating.
• Compact, board-ready package: 1517‑BBGA (1517‑FBGA, 40×40) surface-mount packaging enables high-density PCB designs and consistent assembly processes.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental stewardship.

Why Choose 5SGXMA5K3F40I3NCV?

This Stratix® V GX FPGA balances high logic density, sizable embedded memory, and extensive I/O in an industrial-temperature FCBGA package, making it well suited for engineers building complex digital systems that require on-chip resources and robust thermal performance. The specified core voltage range and surface-mount package support integration into modern, tightly packed board designs.

Choose the 5SGXMA5K3F40I3NCV when your design demands high programmable logic capacity, significant on-chip RAM, and a large number of I/Os within an industrial-rated FPGA package—delivering scalability and reliability for demanding embedded and system-level applications.

Request a quote or submit an inquiry for part number 5SGXMA5K3F40I3NCV to get pricing, availability, or additional technical information. Refer to the device datasheet for full electrical and switching characteristics.