5SGXMA5K3F40I3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

Quantity 964 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F40I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 1517-FBGA (40×40)

The 5SGXMA5K3F40I3G is a Stratix V GX series FPGA in a 1517-BBGA FCBGA package, offered in an industrial temperature grade. It provides a large programmable fabric with approximately 490,000 logic elements, approximately 46 Mbits of embedded memory, and 696 user I/O pins for complex, high-density designs.

Key electrical and system-relevant parameters include a core supply voltage range of 820 mV to 880 mV and an operating temperature range from −40 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount 1517-FBGA (40×40) package.

Key Features

  • Core density  Approximately 490,000 logic elements to implement large-scale programmable logic and complex state machines.
  • Embedded memory  Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and embedded data structures.
  • I/O capacity  696 I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Power and core voltage  Core supply operating range from 820 mV to 880 mV to match system power planning and voltage-rail design.
  • Package and mounting  Supplied in a 1517-BBGA, FCBGA package (supplier package: 1517-FBGA 40×40) for surface-mount PCB integration.
  • Temperature and grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
  • Regulatory compliance  RoHS compliant for global electronics manufacturing and environmental requirements.
  • Documentation  Part of the Stratix V family with comprehensive electrical and switching characteristic data available in the device datasheet.

Unique Advantages

  • High-density programmable fabric: Approximately 490,000 logic elements enable integration of complex digital subsystems on a single device, reducing external components.
  • Significant on-chip memory: Approximately 46 Mbits of embedded RAM supports large buffering and local data storage, simplifying memory architecture.
  • Extensive I/O integration: 696 I/Os provide flexibility for wide parallel buses, multiple interfaces, and rich system connectivity without external multiplexers.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet rigorous environmental requirements for industrial applications.
  • Low-voltage core operation: Core supply range of 0.82 V to 0.88 V supports modern low-voltage system power designs.
  • Compact FCBGA packaging: 1517-FBGA (40×40) surface-mount package enables dense board layouts while keeping the device footprint manageable.

Why Choose 5SGXMA5K3F40I3G?

The 5SGXMA5K3F40I3G combines large logic capacity, substantial embedded memory, and a high pin-count I/O set in an industrial-grade Stratix V GX device. These characteristics make it well suited to designs that require significant on-chip resources and robust environmental performance.

As part of the Stratix V family, this device is supported by comprehensive datasheet documentation covering electrical characteristics, switching behavior, and I/O timing, enabling precise system-level engineering and integration planning.

If you would like pricing, availability, or a formal quote for 5SGXMA5K3F40I3G, submit an inquiry or request a quote from our sales team to begin the procurement process.

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