5SGXMA5K3F40I3LN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

Quantity 390 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5K3F40I3LN – Stratix® V GX Field Programmable Gate Array (FPGA), 1517-BBGA FCBGA

The 5SGXMA5K3F40I3LN is an Intel Stratix® V GX Field Programmable Gate Array supplied in a 1517‑BBGA FCBGA package. It delivers high-density programmable logic and on‑chip memory with a large I/O count for complex digital systems and industrial applications.

With 490,000 logic elements and approximately 46 Mbits of embedded memory, this device targets designs that require substantial logic capacity, extensive I/O connectivity (696 I/Os), and industrial temperature operation.

Key Features

  • Core Logic  490,000 logic elements provide a large programmable fabric for complex algorithms, datapath implementation, and parallel processing.
  • Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, packet storage, and large state machines without external memory.
  • I/O Density & Packaging  696 I/O pins delivered in a 1517‑BBGA (1517‑FBGA 40×40) surface‑mount package for high‑pin‑count system interfaces and dense board layouts.
  • Power Core Supply  Core voltage supply range of 820 mV to 880 mV to match system power-rail specifications and enable predictable core operation.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • Mounting & Compliance  Surface‑mount FCBGA package with RoHS‑compliant status for regulatory and assembly compatibility.

Typical Applications

  • High‑performance communications  Large logic density and abundant I/O make the device suitable for protocol processing, packet handling, and interface bridging in network equipment.
  • Data processing and acceleration  Extensive programmable fabric and embedded memory support on‑chip data buffering and parallel compute tasks for custom accelerators.
  • Industrial control and automation  Industrial temperature rating and broad I/O count enable complex control logic, sensor aggregation, and real‑time signal processing in industrial systems.
  • Advanced embedded systems  High I/O density and significant on‑chip resources enable integration of multiple subsystems on a single FPGA for compact, system‑level designs.

Unique Advantages

  • High integration density: 490,000 logic elements and ~46 Mbits of embedded RAM reduce dependence on external components and simplify system design.
  • Extensive connectivity: 696 I/Os in a compact 1517‑BBGA package provide the pin count needed for complex multi‑lane interfaces and board‑level interconnects.
  • Industrial reliability: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
  • Predictable core power: Defined core supply range (820 mV–880 mV) aids power sequencing and thermal planning during system integration.
  • RoHS compliant: Meets lead‑free regulatory requirements for modern manufacturing and supply chains.

Why Choose 5SGXMA5K3F40I3LN?

The 5SGXMA5K3F40I3LN positions itself as a high‑capacity Stratix V GX FPGA for engineers needing substantial on‑chip logic, memory, and I/O in an industrial‑rated package. Its combination of logic scale, embedded RAM, and dense I/O enables consolidation of multiple functions into a single programmable device, reducing BOM complexity and simplifying board design.

This device is suited to teams developing high‑throughput communications, advanced embedded systems, or industrial control solutions that require long‑term scalability, robust thermal margins, and predictable power characteristics.

Request a quote or submit an inquiry to receive pricing, lead time, and ordering information for the 5SGXMA5K3F40I3LN. Our team can provide support for availability and integration planning.

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