5SGXMA5K3F40I4N

The 5SGXMA5K3F40I4N is an Intel Stratix® V GX family Field Programmable Gate Array (FPGA) offered in a 1517‑BBGA FCBGA, surface‑mount package. This industrial‑grade device delivers high logic density, large on‑chip memory, and extensive I/O connectivity for complex, performance‑oriented designs.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 696 programmable I/Os, the device targets applications that require high integration, multi‑channel interfacing, and robust operation across a wide temperature range.

Key Features

• Core Logic  490,000 logic elements to implement complex programmable logic and custom datapaths.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, on‑chip data storage, and state machines.
• I/O Capacity  696 I/O pins for dense external interfacing and multi‑channel connectivity.
• Transceiver/Series Capability  Part of the Stratix V GX family; series documentation describes GX transceiver speed grades (up to 14.1 Gbps for GX channel configurations).
• Power  Core supply range specified at 820 mV to 880 mV for the device core domain.
• Package & Mounting  1517‑BBGA (FCBGA) supplier package (1517‑FBGA, 40×40) in a surface‑mount form factor for board‑level deployment.
• Temperature & Grade  Industrial grade operation with an ambient range from −40 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑speed communications and networking  Leverage Stratix V GX series transceiver capabilities and the device’s large I/O count for multi‑lane links and protocol bridging.
• Signal processing and compute acceleration  High logic density and substantial on‑chip RAM make the device suitable for FPGA‑based signal pipelines and custom accelerators.
• Industrial control and instrumentation  Industrial temperature rating and robust I/O count enable deployment in control systems, test equipment, and industrial automation.

Unique Advantages

• High integration density: 490,000 logic elements allow consolidation of complex functions into a single FPGA, reducing board‑level BOM and interconnect complexity.
• Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM supports large buffers, local data stores, and high‑throughput processing without external memory in many use cases.
• Extensive connectivity: 696 I/Os accommodate rich external interfaces and parallel signaling requirements.
• Industrial reliability: Specified for −40 °C to 100 °C operation, suitable for demanding ambient conditions.
• Compact, surface‑mount package: 1517‑BBGA (FCBGA) in a 40×40 supplier package enables a compact PCB footprint while supporting high pin counts.
• Low‑voltage core operation: Core supply between 0.82 V and 0.88 V aligns with modern low‑voltage FPGA core domains.

Why Choose 5SGXMA5K3F40I4N?

The 5SGXMA5K3F40I4N combines the Stratix V GX family’s series‑level transceiver capabilities with high logic density, significant embedded memory, and a very large I/O complement—delivered in an industrial‑grade, RoHS‑compliant FCBGA package. This combination positions the device for designs that demand substantial on‑chip resources, multi‑channel interfacing, and operation across extended temperature ranges.

Designed for teams implementing high‑performance FPGA systems, the device suits applications where consolidation, deterministic I/O, and embedded memory capacity reduce system complexity and improve integration. Documentation and device characteristics for the Stratix V family provide the technical details needed to plan and qualify designs around this part.

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