5SGXMA5N1F40C1N

The 5SGXMA5N1F40C1N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1517-BBGA (FCBGA) package. It delivers a high-density programmable fabric with large embedded memory and extensive I/O capability, suitable for complex digital designs that require substantial logic, memory, and connectivity.

Key value propositions include a high logic element count, approximately 46 Mbits of on-chip RAM, 600 I/O pins, and low-voltage core operation — enabling dense integration of custom logic and high-bandwidth interfacing in commercial-temperature systems.

Key Features

• Core Logic  Approximately 490,000 logic elements for implementing large-scale FPGA designs and complex custom logic functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support data buffering, packet processing, and state storage inside the FPGA fabric.
• I/O Capacity  600 I/O pins provide broad connectivity options for multi-channel interfaces and parallel bus architectures.
• Package & Mounting  1517-BBGA (FCBGA) supplier device package listed as 1517-FBGA (40×40); surface-mount device suitable for compact board designs.
• Power & Core Voltage  Core operating voltage specified between 870 mV and 930 mV, enabling low-voltage core operation.
• Operating Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance digital systems  Use the large logic fabric and on-chip RAM to implement custom accelerators and complex state machines.
• Multi-channel I/O and interface bridging  600 I/Os enable dense peripheral interfacing, protocol bridging, and parallel processing front-ends.
• Network and packet processing  Large embedded memory and logic resources support buffering, parsing, and custom packet-handling pipelines.
• Prototyping and system integration  High-density FPGA fabric facilitates system-level prototyping and integration of custom IP blocks.

Unique Advantages

• Highly integrated programmable fabric: Approximately 490,000 logic elements let you consolidate complex logic into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM supports data-intensive tasks without external memory in many use cases.
• Extensive I/O capability: 600 I/O pins provide flexibility for multi-lane interfaces and parallel connectivity.
• Compact FCBGA packaging: 1517-BBGA / 1517-FBGA (40×40) package supports high-density PCB layouts for space-constrained systems.
• Low-voltage core operation: 870 mV to 930 mV core voltage supports modern low-voltage power architectures.
• Commercial temperature range: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial applications.

Why Choose 5SGXMA5N1F40C1N?

The 5SGXMA5N1F40C1N positions itself as a high-density, high-connectivity FPGA solution for commercial designs that require substantial programmable logic, embedded memory, and large I/O capacity. Its combination of approximately 490,000 logic elements, roughly 46 Mbits of on-chip RAM, and 600 I/Os enables consolidation of complex digital functions and flexible system interfacing within a single FCBGA package.

This device is well-suited to engineering teams building advanced digital systems, network and packet-processing modules, or integration-heavy prototypes that benefit from a dense FPGA fabric, compact packaging, and low-voltage core operation. RoHS compliance and commercial temperature rating support mainstream product development and deployment.

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