5SGXMA5N1F40C2G

The 5SGXMA5N1F40C2G is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers high logic capacity and large on‑chip memory in a surface-mount, high-pin-count package for complex digital designs.

Targeted at designs that require dense logic resources, substantial embedded RAM, and extensive I/O, this commercial-grade device is specified for operation from 0 °C to 85 °C and a core supply range of 870 mV to 930 mV.

Key Features

• Logic Capacity  Approximately 490,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support memory-intensive algorithms and buffering.
• I/O Count  600 user I/Os to accommodate high-pin-count interfaces and board-level connectivity.
• Package & Mounting  1517-BBGA (FCBGA) / supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
• Power  Core voltage supply specified from 870 mV to 930 mV to match system power rails and design constraints.
• Temperature Grade  Commercial operation specified from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and embedded RAM support complex signal processing, algorithm acceleration, and compute‑intensive datapaths.
• High‑I/O systems  Up to 600 I/Os suit multi‑lane interfaces, large sensor arrays, and board-level crossbar or bridging applications.
• Embedded memory-dependent designs  Approximately 46 Mbits of on-chip RAM provides local storage for packet buffering, FIFOs, and intermediate data.
• Prototyping and system integration  A high-pin-count FCBGA package enables integration into production-like boards for prototype validation and system integration testing.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM minimizes external memory dependencies for many buffering and state‑storage needs.
• High I/O density: 600 I/Os provide flexibility for complex interfacing and parallel data paths without additional I/O expanders.
• Compact, production-ready package: 1517-FBGA (40×40) surface-mount package supports high-pin-count implementations in a single FPGA footprint.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for typical commercial and enterprise environments.
• RoHS compliant: Meets common materials and environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA5N1F40C2G?

The 5SGXMA5N1F40C2G balances very large programmable logic capacity with significant embedded memory and a high I/O count in a production-friendly FCBGA package. Its commercial temperature rating and defined core voltage range make it suitable for demanding board-level designs that require dense integration and ample on‑chip resources.

Designed and documented within Intel’s Stratix V GX family, this device is appropriate for teams building complex digital systems that benefit from consolidated logic, local memory, and extensive interfacing while relying on manufacturer documentation for integration and validation.

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