5SGXMA5K3F40I4WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,881 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K3F40I4WN – Stratix® V GX FPGA, 696 I/O, 1517‑BBGA
The 5SGXMA5K3F40I4WN is a Stratix V GX field‑programmable gate array (FPGA) optimized for high‑density logic integration and extensive I/O. This industrial‑grade device combines large logic capacity and embedded memory with a high I/O count to support complex digital systems.
Targeted at industrial applications that require robust operation across a wide temperature range, the device delivers scalable logic resources, significant on‑chip RAM, and packaging suited for surface‑mount system assembly.
Key Features
- Logic Capacity Approximately 490,000 logic elements to implement complex state machines, datapaths, and custom compute blocks.
- Embedded Memory Approximately 46.08 Mbits of on‑chip RAM for buffering, lookup tables, and data processing tasks.
- I/O Density 696 device I/O pins provide extensive connectivity for peripherals, sensors, and external memory interfaces.
- Power/Core Voltage Core supply range from 0.820 V to 0.880 V to meet device operating requirements.
- Package & Mounting 1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40); designed for surface mount assembly.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Regulatory Compliance RoHS‑compliant manufacturing.
- Stratix V GX Series Part of the Stratix V GX family with device-level transceiver and I/O timing characteristics described in the Stratix V device documentation.
Typical Applications
- High‑Speed Serial Connectivity Implement high‑speed transceiver interfaces and multi‑Gb/s serial links using the Stratix V GX family transceiver capabilities described for the series.
- Compute Acceleration & DSP Leverage large logic resources and on‑chip memory to implement accelerated datapaths, custom compute engines, and signal processing pipelines.
- Industrial Control & Automation Industrial temperature rating and extensive I/O make the device suitable for complex control systems, machine automation, and industrial communication endpoints.
Unique Advantages
- High Logic Density: Approximately 490,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board area.
- Substantial On‑Chip Memory: Approximately 46.08 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory bandwidth needs.
- Large I/O Count: 696 I/O pins provide flexibility to interface with a wide range of peripherals and board-level signals without external expanders.
- Industrial Reliability: Rated for –40 °C to 100 °C operation to withstand demanding industrial environments.
- Surface‑Mount FCBGA Packaging: 1517‑BBGA (40×40) package supports high‑density PCB layouts and automated assembly processes.
- Standards‑Forward Design: RoHS compliance supports regulatory and environmental requirements for commercial and industrial products.
Why Choose 5SGXMA5K3F40I4WN?
This Stratix V GX FPGA combines large logic capacity, significant embedded memory, and a very high I/O count to address demanding industrial designs that require on‑board processing, complex connectivity, and robust operation. Its package and surface‑mount form factor support high‑density system integration.
Engineers and procurement teams designing industrial communication equipment, compute accelerators, or advanced control systems will find the device well suited for applications that need scalable logic, ample local memory, and broad external interfacing while maintaining industrial temperature performance and RoHS compliance.
Request a quote or contact sales to discuss availability, lead times, and how the 5SGXMA5K3F40I4WN can fit into your next design.

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