5SGXMA5N2F40C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 924 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N2F40C2G – Stratix® V GX FPGA, 600 I/O, approximately 46.08 Mbits RAM, 490,000 logic elements
The 5SGXMA5N2F40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. This commercial-grade device delivers a very large logic fabric, substantial embedded memory, and high I/O density for complex digital designs that require extensive programmable resources.
Designed for surface-mount applications, the device is specified for a 0 °C to 85 °C operating range and a core supply range of 870 mV to 930 mV, making it suitable for standard commercial electronic systems where high integration and configurability are required.
Key Features
- Core logic capacity — 490,000 logic elements (cells) to support large, complex designs and high-density logic implementations.
- Embedded memory — approximately 46.08 Mbits of on-chip RAM to support large buffers, frame storage, and memory-intensive algorithms.
- High I/O count — 600 user I/Os for extensive external interfacing, multi-channel connectivity, and board-level integration.
- Package and mounting — 1517-BBGA, FCBGA (supplier package 1517-FBGA, 40×40) in a surface-mount form factor for compact, high-density PCB layouts.
- Power supply — specified core voltage range of 870 mV to 930 mV for predictable core power planning.
- Commercial temperature grade — rated for operation from 0 °C to 85 °C for mainstream commercial environments.
- Standards compliance — RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- High-density digital processing — large logic capacity and substantial on-chip RAM enable complex signal processing, algorithms, and compute-intensive tasks.
- Multi-channel system interfacing — 600 I/Os support extensive peripheral connectivity, parallel data paths, and board-level integration.
- Network and packet processing — abundant logic and memory resources make the device suitable for custom packet handling, buffering, and protocol processing in commercial networking equipment.
- Prototyping and production FPGA systems — surface-mount FCBGA package and commercial temperature rating fit both development platforms and deployed commercial products requiring high integration.
Unique Advantages
- Massive programmable logic: 490,000 logic elements provide headroom for complex designs and multi-function implementations without partitioning across multiple devices.
- Significant on-chip memory: approximately 46.08 Mbits of embedded RAM reduces external memory dependency and simplifies board design.
- Extensive I/O density: 600 I/Os enable rich external connectivity and support for multiple peripherals or high-channel-count interfaces.
- Compact surface-mount FCBGA package: 1517-BBGA (1517-FBGA, 40×40) supports high-density PCB routing while keeping board footprint efficient.
- Commercial-grade operating range: 0 °C to 85 °C aligns with standard commercial deployments and simplifies thermal design for such environments.
- RoHS compliance: Meets common environmental manufacturing standards for streamlined production and regulatory alignment.
Why Choose 5SGXMA5N2F40C2G?
The 5SGXMA5N2F40C2G provides a combination of very large logic capacity, substantial embedded memory, and high I/O count in a compact surface-mount FCBGA package, making it well suited for demanding commercial FPGA applications that require integration and scalability. Its specified core voltage range and commercial temperature rating allow predictable power and thermal planning for production designs.
This part is ideal for engineering teams developing high-density digital processing, multi-channel interfacing, or custom networking solutions that benefit from a single-device implementation of large programmable logic and on-chip memory resources.
If you would like a quote or additional procurement information for 5SGXMA5N2F40C2G, submit a request for a quote or contact the sales channel to request pricing and availability.

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