5SGXMA5N2F40C1G

The 5SGXMA5N2F40C1G is a Stratix V GX Field Programmable Gate Array (FPGA) IC by Intel. It delivers very high logic capacity and on-chip memory in a 1517-BBGA FCBGA package for commercial-temperature designs.

Key on-device resources include 490,000 logic elements, approximately 46 Mbits of embedded memory, and 600 general-purpose I/O pins, making this device suitable for complex, high-density digital implementations that require substantial local RAM and I/O connectivity.

Key Features

• Core Logic 490,000 logic elements provide significant capacity for large-scale RTL designs and complex programmable logic implementations.
• Embedded Memory Approximately 46 Mbits of on-chip RAM to support data buffering, lookup tables, and large on-chip datasets.
• I/O Density 600 I/O pins enable extensive peripheral, board-level, and mezzanine connectivity for multi-channel systems.
• Power Core voltage supply range specified at 870 mV to 930 mV for the device core power domain.
• Package & Mounting 1517-BBGA, FCBGA (supplier package 1517-FBGA, 40×40) in a surface-mount format for high-density board layouts.
• Operating Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance RoHS compliant.

Typical Applications

• High-density digital processing: Leverage 490,000 logic elements and approximately 46 Mbits of embedded memory for complex signal processing, algorithm acceleration, and large state machines.
• Multi-channel I/O systems: Use 600 I/Os to implement systems with extensive board-level interfacing, parallel data paths, or multi-protocol front-ends.
• Prototyping and system integration: Surface-mount 1517-BBGA packaging supports compact, high-density PCB designs for proof-of-concept and integration of large FPGA subsystems.

Unique Advantages

• High logic capacity: 490,000 logic elements provide headroom for large designs and integration of multiple subsystems on a single device, reducing BOM complexity.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM supports data-intensive tasks and reduces dependence on external memory, improving system latency.
• Extensive I/O connectivity: 600 I/Os allow flexible partitioning of functions across banks and direct interfacing to a broad range of peripherals and boards.
• Compact, manufacturing-ready package: 1517-BBGA FCBGA surface-mount package enables dense board-level integration for space-constrained systems.
• Commercial temperature grade: Designed for 0 °C to 85 °C operation to match standard commercial deployments and development environments.
• RoHS compliant: Meets regulatory requirements for lead-free assembly and environmental standards.

Why Choose 5SGXMA5N2F40C1G?

The 5SGXMA5N2F40C1G combines very large logic capacity, ample embedded memory, and high I/O count in a compact FCBGA package, positioning it for designs that demand integrated, high-density programmable logic. Its specified core voltage range and commercial operating temperature make it suitable for mainstream embedded and digital systems where on-chip resources and I/O flexibility are primary selection criteria.

Backed by Intel's Stratix V family documentation for device electrical and switching characteristics, this device is a practical choice for teams building large FPGA-based subsystems that require extensive local RAM and broad connectivity while maintaining commercial-grade operating conditions.

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