5SGXMA5N2F40C1N

The 5SGXMA5N2F40C1N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1517-BBGA FCBGA package. This commercial-grade device delivers very high logic density, large on-chip memory, and extensive I/O capability for complex digital designs.

Targeted for designs that require significant programmable logic capacity and dense I/O, the device combines 490,000 logic elements with approximately 46 Mbits of embedded memory and 600 I/O pins to support sophisticated system integration and high-channel count interfaces.

Key Features

• High Logic Density — 490,000 logic elements to implement large-scale digital designs and multi-function SoC-style architectures.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for large buffers, FIFOs, and memory-intensive processing without external memory dependence.
• Extensive I/O — 600 user I/O pins to support high channel counts and complex peripheral connectivity.
• Package & Mounting — 1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40) in a surface-mount form factor for compact board placement.
• Power Supply Range — Core voltage supply specified from 870 mV to 930 mV for defined power and performance operation.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C to suit commercial-environment deployments.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• High-density digital processing — Implement large combinational and sequential logic functions where significant logic elements and on-chip memory are required.
• Interface aggregation — Consolidate multiple peripheral and protocol interfaces using the device’s 600 I/O pins for high-channel-count applications.
• Embedded system integration — Use the large embedded RAM to support moderate on-chip storage needs such as buffering, packet processing, or custom accelerators.

Unique Advantages

• Large programmable fabric — 490,000 logic elements provide the capacity to implement complex IP and multi-module systems on a single device, reducing board-level component count.
• Substantial on-chip memory — Approximately 46 Mbits of RAM reduces the need for external memory in many buffering and processing tasks, simplifying BOM and layout.
• High I/O count — 600 I/O pins enable flexible interface routing and support for extensive external connectivity without multiplexing compromises.
• Compact SMD package — 1517-BBGA (40×40) surface-mount package balances high pin count with a compact footprint for space-constrained designs.
• Defined operating window — Commercial temperature range (0 °C to 85 °C) and a specified core supply range (870 mV–930 mV) allow precise thermal and power budgeting during system design.
• Environmental compliance — RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5SGXMA5N2F40C1N?

The 5SGXMA5N2F40C1N is positioned for designs that demand very high logic capacity, substantial embedded memory, and broad I/O resources within a compact BGA package. Its commercial temperature rating and defined voltage window make it suitable for enterprise and commercial electronics where predictable electrical and thermal behavior is required.

Choosing this Stratix V GX device provides designers with an integrated platform to consolidate functions, reduce external components, and support complex digital and interface-rich systems while maintaining compliance with RoHS requirements.

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