5SGXMA5N1F45I2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,293 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5N1F45I2WN – Stratix® V GX FPGA, 490,000 logic elements
The 5SGXMA5N1F45I2WN is a Stratix V GX field programmable gate array (FPGA) in a high-density 1932-BBGA FCBGA package. It delivers substantial on-chip logic and embedded memory with a large I/O complement, aimed at complex digital designs that require significant integration in an industrial-temperature device.
With approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 840 user I/O, this device targets applications that need high capacity, flexible I/O, and robust thermal performance while operating from a low-voltage core supply (870 mV–930 mV).
Key Features
- Core capacity Approximately 490,000 logic elements for large-scale, configurable digital designs.
- Embedded memory Approximately 46 Mbits of on-chip RAM (46,080,000 bits) to support buffering, FIFOs, and data-intensive logic blocks.
- High I/O count 840 user I/O pins to enable broad connectivity to peripherals, memory interfaces, and board-level I/O.
- Power and core voltage Core supply range of 870 mV to 930 mV to support the device’s low-voltage core operation.
- Package and mounting 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device for modern PCB assembly.
- Industrial temperature range Rated for operation from −40 °C to 100 °C and specified as an industrial-grade device.
- Standards compliance RoHS-compliant manufacturing status.
Typical Applications
- Communications infrastructure Implements complex protocol logic and wide parallel I/O for networking equipment and baseband processing.
- High-performance computing and acceleration Provides the logic density and on-chip RAM needed for algorithm acceleration and custom compute pipelines.
- Industrial control and automation Industrial temperature rating and extensive I/O make it suitable for factory automation, motor control logic, and supervisory systems.
- Imaging and video processing Large logic and embedded memory resources support real-time image pipelines, buffering, and custom video datapaths.
Unique Advantages
- Large programmable fabric Approximately 490k logic elements reduce the need for multiple devices in high-complexity designs, simplifying board-level integration.
- Substantial on-chip memory Around 46 Mbits of embedded RAM enables efficient local buffering and state storage without external memory for many use cases.
- Extensive I/O 840 I/O pins provide flexibility to interface with diverse peripherals, sensors, and high-pin-count memories directly.
- Industrial robustness Rated for −40 °C to 100 °C operation, making it suitable for deployment in demanding environmental conditions.
- Compact, production-ready package 1932-BBGA FCBGA surface-mount packaging supports high-density PCB layouts and automated assembly.
- RoHS compliance Manufactured to RoHS standards for regulatory and environmental conformity.
Why Choose 5SGXMA5N1F45I2WN?
The 5SGXMA5N1F45I2WN positions itself as a high-capacity Stratix V GX FPGA option when substantial logic resources, embedded memory, and large I/O counts are required in an industrial-temperature device. Its combination of approximately 490,000 logic elements, ~46 Mbits of on-chip RAM, and 840 I/O enables consolidation of complex functions into a single programmable device, reducing BOM complexity and board area.
This device is suited for engineers designing advanced communications, compute acceleration, industrial control, and imaging systems who need a scalable, robust FPGA platform with a low-voltage core and industry-standard packaging.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMA5N1F45I2WN FPGA.

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