5SGXMA5N1F45I2WN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 1,293 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXMA5N1F45I2WN – Stratix® V GX FPGA, 490,000 logic elements

The 5SGXMA5N1F45I2WN is a Stratix V GX field programmable gate array (FPGA) in a high-density 1932-BBGA FCBGA package. It delivers substantial on-chip logic and embedded memory with a large I/O complement, aimed at complex digital designs that require significant integration in an industrial-temperature device.

With approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 840 user I/O, this device targets applications that need high capacity, flexible I/O, and robust thermal performance while operating from a low-voltage core supply (870 mV–930 mV).

Key Features

  • Core capacity  Approximately 490,000 logic elements for large-scale, configurable digital designs.
  • Embedded memory  Approximately 46 Mbits of on-chip RAM (46,080,000 bits) to support buffering, FIFOs, and data-intensive logic blocks.
  • High I/O count  840 user I/O pins to enable broad connectivity to peripherals, memory interfaces, and board-level I/O.
  • Power and core voltage  Core supply range of 870 mV to 930 mV to support the device’s low-voltage core operation.
  • Package and mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device for modern PCB assembly.
  • Industrial temperature range  Rated for operation from −40 °C to 100 °C and specified as an industrial-grade device.
  • Standards compliance  RoHS-compliant manufacturing status.

Typical Applications

  • Communications infrastructure  Implements complex protocol logic and wide parallel I/O for networking equipment and baseband processing.
  • High-performance computing and acceleration  Provides the logic density and on-chip RAM needed for algorithm acceleration and custom compute pipelines.
  • Industrial control and automation  Industrial temperature rating and extensive I/O make it suitable for factory automation, motor control logic, and supervisory systems.
  • Imaging and video processing  Large logic and embedded memory resources support real-time image pipelines, buffering, and custom video datapaths.

Unique Advantages

  • Large programmable fabric  Approximately 490k logic elements reduce the need for multiple devices in high-complexity designs, simplifying board-level integration.
  • Substantial on-chip memory  Around 46 Mbits of embedded RAM enables efficient local buffering and state storage without external memory for many use cases.
  • Extensive I/O  840 I/O pins provide flexibility to interface with diverse peripherals, sensors, and high-pin-count memories directly.
  • Industrial robustness  Rated for −40 °C to 100 °C operation, making it suitable for deployment in demanding environmental conditions.
  • Compact, production-ready package  1932-BBGA FCBGA surface-mount packaging supports high-density PCB layouts and automated assembly.
  • RoHS compliance  Manufactured to RoHS standards for regulatory and environmental conformity.

Why Choose 5SGXMA5N1F45I2WN?

The 5SGXMA5N1F45I2WN positions itself as a high-capacity Stratix V GX FPGA option when substantial logic resources, embedded memory, and large I/O counts are required in an industrial-temperature device. Its combination of approximately 490,000 logic elements, ~46 Mbits of on-chip RAM, and 840 I/O enables consolidation of complex functions into a single programmable device, reducing BOM complexity and board area.

This device is suited for engineers designing advanced communications, compute acceleration, industrial control, and imaging systems who need a scalable, robust FPGA platform with a low-voltage core and industry-standard packaging.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMA5N1F45I2WN FPGA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up